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2020
1 Vereshchagina, Elizaveta; Shakalisava, Yuliya; Suphellen, Aina; Moe, Sigurd T.; Hankemeier, Thomas.
Technological aspects of devices for efficient ion concentration polarization and electro-driven separation with ultra-shallow nanochannels. The 24th International Conference on Miniaturized Systems for Chemistry and Life Sciences (µTAS 2020); 2020-10-04 - 2020-10-10
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2019
2 Jain, Shruti; Mielnik, Michal M.; Moe, Sigurd T..
A Novel Method for Depositing Patterned BCB using Spotter for Low Temperature Wafer Level Bonding. MNE2019; 2019-09-23 - 2019-09-26
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3 Sordo, Guido; Wright, Daniel Nilsen; Moe, Sigurd T.; collini, cristian.
Through Silicon Vias in MEMS packaging, a review. NordPac 2019; 2019-06-11 - 2019-06-13
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2018
4 Moe, Sigurd T.; Taklo, Maaike Margrete Visser.
Vertical Interconnects for High-End MEMS. I: MEMS Packaging. World Scientific 2018 ISBN 978-981-3229-35-8. s. 45-52
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5 Vereshchagina, Elizaveta; Poppe, Erik Utne; Schjølberg-Henriksen, Kari; Wöhrmann, Markus; Moe, Sigurd T..
Metal Films for MEMS Pressure Sensors: Comparison of Al, Ti, Al-Ti Alloy and Al/Ti Film Stacks. I: 2018 7th Electronic System-Integration Technology Conference (ESTC), Dresden, Germany, 18-21 Sept. 2018. IEEE 2018 ISBN 978-1-5386-6814-6. s. -
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6 Vereshchagina, Elizaveta; Poppe, Erik Utne; Schjølberg-Henriksen, Kari; Wöhrmann, Markus; Moe, Sigurd T..
Metal films for MEMS pressure sensors: comparison of Al, Ti, Al-Ti alloy and Al/Ti film stacks. 7th Electronics System-Integration Technology Conference; 2018-09-18 - 2018-09-21
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2017
7 Taklo, Maaike M. Visser; Schjølberg-Henriksen, Kari; Malik, Nishant; Poppe, Erik Utne; Moe, Sigurd T.; Finstad, Terje.
Al-Al Wafer-Level Thermocompression Bonding applied for MEMS. 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2017); 2017-05-16 - 2017-05-18
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8 Taklo, Maaike M. Visser; Schjølberg-Henriksen, Kari; Malik, Nishant; Poppe, Erik Utne; Moe, Sigurd T.; Finstad, Terje.
Al-Al Wafer-Level Thermocompression Bonding applied for MEMS. I: 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), Tokyo, 16-18 May 2017. IEEE 2017 ISBN 978-4-904743-03-4. s. 11-11
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2016
9 Poppe, Erik Utne; Jensen, Geir Uri; Moe, Sigurd T.; Wang, Dag Thorstein.
Plastic Deformation of Thin Si Membranes in Si-Si Direct Bonding. PRiME 2016; 2016-10-02 - 2016-10-07
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10 Poppe, Erik Utne; Jensen, Geir Uri; Moe, Sigurd T.; Wang, Dag Thorstein.
Plastic Deformation of Thin Si Membranes in Si-Si Direct Bonding. ECS Transactions 2016 ;Volum 75.(9) s. 311-319
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2015
11 Brand, Sebastian; Tismer, Sebastian; Moe, Sigurd T.; Schjølberg-Henriksen, Kari.
Non-destructive wafer-level bond defect identification by scanning acoustic microscopy. Microsystem Technologies : Micro- and Nanosystems Information Storage and Processing Systems 2015 ;Volum 21.(7) s. 1385-1394
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12 Schjølberg-Henriksen, Kari; Malik, Nishant; Gundersen, Elin Vold; Christiansen, Oscar Rincon; Imenes, Kristin; Fournel, Frank; Moe, Sigurd T..
Electrical, Mechanical, and Hermetic Properties of Low-Temperature, Plasma Activated Direct Silicon Bonded Joints. ECS Journal of Solid State Science and Technology 2015 ;Volum 4.(7) s. P265-P271
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13 Schjølberg-Henriksen, Kari; Tvedt, Lars Geir Whist; Gjelstad, Stein Are; Mørk, Christopher; Moe, Sigurd T.; Imenes, Kristin; Poppe, Erik; Wang, Dag Thorstein.
Conductivity of high-temperature annealed silicon direct wafer bonds. Microsystem Technologies : Micro- and Nanosystems Information Storage and Processing Systems 2015 ;Volum 21.(5) s. 979-985
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2014
14 Schjølberg-Henriksen, Kari; Malik, Nishant; Gundersen, Elin Vold; Christiansen, Oscar Rincon; Imenes, Kristin; Moe, Sigurd T..
Electrical, Mechanical, and Hermeticity Properties of Low-Temperature, Plasma Activated Direct Silicon Bonded Joints. I: 2014 ECS and SMEQ Joint International Meeting, October 5, 2014 - October 9, 2014 Semiconductor Wafer Bonding 13: Science, Technology, and Applications. Pennington, New Jersey: The Electrochemical Society 2014 ISBN 978-1-62332-185-7. s. 275-284
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15 Schjølberg-Henriksen, Kari; Malik, Nishant; Gundersen, Elin Vold; Christiansen, Oscar Rincon; Imenes, Kristin; Moe, Sigurd T..
Electrical, Mechanical, and Hermeticity Properties of Low-Temperature, Plasma Activated Direct Silicon Bonded Joints. The 226th Meeting of the Electrochemical Society; 2014-10-05 - 2014-10-09
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16 Schjølberg-Henriksen, Kari; Malik, Nishant; Sandvand, Åsmund; Kittilsland, Gjermund; Moe, Sigurd T..
Leak Rates and Residual Gas Pressure in Cavities Sealed by Metal Thermo-Compression Bonding and Silicon Direct Bonding. The 226th Meeting of the Electrochemical Society; 2014-10-05 - 2014-10-09
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17 Schjølberg-Henriksen, Kari; Malik, Nishant; Sandvand, Åsmund; Kittilsland, Gjermund; Moe, Sigurd T..
Leak Rates and Residual Gas Pressure in Cavities Sealed by Metal Thermo-Compression Bonding and Silicon Direct Bonding. I: 2014 ECS and SMEQ Joint International Meeting, October 5, 2014 - October 9, 2014 Semiconductor Wafer Bonding 13: Science, Technology, and Applications. Pennington, New Jersey: The Electrochemical Society 2014 ISBN 978-1-62332-185-7. s. 305-314
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18 Schjølberg-Henriksen, Kari; Tvedt, Lars Geir Whist; Gjelstad, Stein Are; Mørk, Christopher; Moe, Sigurd T.; Imenes, Kristin; Poppe, Erik; Wang, Dag Thorstein.
Bond strength of conductive Si-Si fusion bonded seals. DTIP; 2014-04-01 - 2014-04-04
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19 Schjølberg-Henriksen, Kari; Tvedt, Lars Geir Whist; Moe, Sigurd T.; Poppe, Erik; Wang, Dag Thorstein; Gjelstad, Stein Are; Mørk, Christopher; Imenes, Kristin.
Bond strength of conductive Si-Si bonded seals. I: Symposium on Design, test, Integration & Packaging of MEMS/MOEMS, Cannes, France, 1-4 April, 2014. EDA Publishing Association 2014 ISBN 9782355000287. s. 312-317
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20 Vereshchagina, Elizaveta; Poppe, Erik; Schjølberg-Henriksen, Kari; Venkatachalapathy, Vishnukanthan; Moe, Sigurd T..
ANALYSIS OF RESIDUAL STRESS AND THERMAL HYSTERESIS IN SPUTTERED ALUMINIUM THIN FILMS. Micromechanics Europe 2014; 2014-09-01 - 2014-09-03
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2013
21 Clausen, Ingelin; Tvedt, Lars Geir Whist; Moe, Sigurd T.; Vogl, Andreas.
The effect of true human synovial fluid on the functionality of an in vivo pressure sensor element. I: IEEE Sensors 2013, Baltimore, USA, 3-6 November, 2013. IEEE 2013 ISBN 978-1-4673-4640-5. s. 1755-1758
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22 Clausen, Ingelin; Tvedt, Lars Geir Whist; Moe, Sigurd T.; Vogl, Andreas.
The effect of true human synovial fluid on the functionality of an in vivo pressure sensor element. IEEE Sensors 2013; 2013-11-03 - 2013-11-06
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23 Schjølberg-Henriksen, Kari; Tvedt, Lars Geir Whist; Gjelstad, Stein Are; Mørk, Christopher; Moe, Sigurd T.; Imenes, Kristin; Poppe, Erik; Wang, Dag Thorstein.
Conductive hydrophilic and hydrophobic high-temperature silicon direct wafer bonding. WaferBond'13; 2013-12-05 - 2013-12-06
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2012
24 Clausen, Ingelin; Moe, Sigurd T.; Vogl, Andreas.
Design and processing of a cost-effective piezoresistive MEMS cantilever sensor for medical and biomedical use. Journal of Micromechanics and Microengineering (JMM) 2012 ;Volum 22.(7) s. -
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25 Lacolle, Matthieu Jean P; Johansen, Ib-Rune; Wang, Dag Thorstein; Moe, Sigurd T.; Sagberg, Håkon; Clausen, Sigmund; Karlsson, Arne; Akporiaye, Duncan.
Fabrication of an array of silicon microscales for the monitoring of chemical processes. Journal of Micromechanics and Microengineering (JMM) 2012 ;Volum 22.(7) s. -
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2011
26 Clausen, Ingelin; Moe, Sigurd T.; Tvedt, Lars Geir Whist; Vogl, Andreas; Wang, Dag Thorstein.
A miniaturized pressure sensor with inherent biofouling protection designed for in vivo applications. IEEE Engineering in Medicine and Biology Society. Conference Proceedings 2011 s. 1880-1883
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27 Clausen, Ingelin; Moe, Sigurd T.; Vogl, Andreas.
Cost-effective processing of a piezoresistive MEMS cantilever sensor. I: MME 2011: Proceedings of the 22nd Micromechanics and microsystems technology Europe workshop: 19-22 June 2011 Tønsberg, Norway. Tønsberg: Vestfold University College 2011 ISBN 978-82-7860-224-9. s. 65-68
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2008
28 Bakke, Thor; Lacolle, Matthieu Jean P; Sagberg, Håkon; Johansen, Ib-Rune; Moe, Sigurd T..
Optical MEMS filter for infrared gas detection. Norsk Elektrooptikkmøte 2008; 2008-03-26 - 2008-03-29
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29 Schjølberg-Henriksen, Kari; Moe, Sigurd T.; Taklo, Maaike Margrete Visser; Storas, P; Ulvensøen, Jon Herman.
Low-temperature plasma activated bonding for a variable optical attenuator. Sensors and Actuators A-Physical 2008 ;Volum 142.(1) s. 413-420
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30 Schjølberg-Henriksen, Kari; Schulz, Olaf; Ferber, Alain Marc C; Moe, Sigurd T.; Lloyd, Martin; Muller, Gerhard; Suphan, Karl-Heinz; Wang, Dag Thorstein; Bernstein, Ralph W..
Sensitive and Selective Photoacoustic Gas Sensor Suitable for High-Volume Manufacturing. IEEE Sensors Journal 2008 ;Volum 8.(9-10) s. 1539-1545
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2007
31 Sagberg, Håkon; Bakke, Thor; Johansen, Ib-Rune; Lacolle, Matthieu Jean P; Moe, Sigurd T..
Two-state Optical Filter Based on Micromechanical Diffractive Elements. I: 2007 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, Hualien, Taiwan Aug 12-16, 2007. IEEE 2007 ISBN 9781424406418. s. 167-168
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2006
32 Lietaer, Nicolas; Storås, Preben; Breivik, Lars; Moe, Sigurd T..
Development of cost-effective high-density through-wafer interconnects for 3D microsystems. Journal of Micromechanics and Microengineering (JMM) 2006 ;Volum 16.(6 Spesial Issue)
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33 Schjølberg-Henriksen, Kari; Ferber, Alain Marc C; Moe, Sigurd T.; Wang, Dag Thorstein; Bernstein, Ralph W.; Rogne, Henrik; Schulz, O.; Lloyd, M.; Suphan, K.-H.; Müller, G..
Sensitive and Selective Photo Acoustic Gas Sensor Suitable for High Volume Manufacturing. I: 5th IEEE Conference on Sensors, 2006. : IEEE 2006 ISBN 1424403766. s. 679-682
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34 Schjølberg-Henriksen, Kari; Ferber, Alain Marc C; Wang, Dag Thorstein; Moe, Sigurd T.; Schulz, O.; Lloyd, M.; Suphan, K-H.; Bernstein, R.W.; Rogne, H.; Müller, G..
Sensitive and Selective Photo Acoustic Gas Sensor Suitable for High Volume Manufacturing. IEEE Sensors Conference; 2006-10-25
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35 Schjølberg-Henriksen, Kari; Poppe, Erik; Moe, Sigurd T.; Storås, Preben; Taklo, Maaike Margrete Visser; Wang, Dag Thorstein; Jakobsen, Henrik.
Anodic bonding of glass to aluminum. Microsystem Technologies : Micro- and Nanosystems Information Storage and Processing Systems 2006 ;Volum 12. s. 441-450
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36 Schjølberg-Henriksen, Kari; Wang, Dag Thorstein; Rogne, Henrik; Ferber, Alain Marc C; Vogl, Andreas; Moe, Sigurd T.; Bernstein, Ralph W.; Lapadatu, Daniel; Sandven, Knut; Brida, Sebastiano.
High-resolution pressure sensor for photo acoustic gas detection. Sensors and Actuators A-Physical 2006 ;Volum 132. s. 207-213
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2005
37 Lietaer, Nicolas; Breivik, Lars; Moe, Sigurd T..
Development of cost-effective high-density through-wafer interconnects for 3D microsystems. 16th European Workshop on Micromechanics (MME 2005); 2005-09-04 - 2005-09-06
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2004
38 Jakobsen, Henrik; Schjølberg-Henriksen, Kari; Poppe, Erik; Moe, S; Taklo, Maaike Margrete Visser; Wang, Dag Thorstein.
Anodic bonding of glass to aluminium. Workshop on Wafer Bonding for MEMS; 2004-10-10 - 2004-10-12
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2000
39 Moe, Sigurd T.; Schjølberg-Henriksen, Kari; Wang, Dag Thorstein; Lund, E; Nysæther, J; Furuberg, Liv; Taklo, Maaike Margrete Visser; Fallet, Truls; Bernstein, R W.
Capative Differential Pressure sensor for Harsh Environment. Sensors and Actuators A-Physical 2000 ;Volum 83.(1-3) s. 30-33
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40 Moe, Sigurd T.; Schjølberg-Henriksen, Kari; Wang, Dag Thorstein; Lund, Eivind; Nysæther, Jon Barratt; Furuberg, Liv; Taklo, Maaike Margrete Visser; Fallet, Truls; Bernstein, R. W..
Capacitive differential pressure sensor for harsh environments. Sensors and Actuators A-Physical 2000 ;Volum 83.(1-3) s. 30-33
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41 Taklo, Maaike Margrete Visser; Moe, S. T.; Hanneborg, Anders Bror.
Diffusion at anodically bonded interfaces. The 11th workshop on Micromachining, Micromechanics and Microsystems; 2000-10-01
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1999
42 Taklo, Maaike Margrete Visser; Wang, Dag Thorstein; Moe, S. T.; Schjølberg-Henriksen, Kari; Hanneborg, Anders Bror.
Pressure Sensor for Harsh Environments Realized by Triple-Stack Fusion Bonding. Fifth International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications; 1999-10-17
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