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2019
1 Segal, Julie; Lietaer, Nicolas; Povoli, Marco.
Thinned Commercial Foundry-built High Energy Physics Sensors using Microwave Anneal. 2019 IEEE Nuclear Science Symposium & Medical Imaging Conference; 2019-10-26 - 2019-11-02
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2018
2 Koybasi, Ozhan; Povoli, Marco; Kok, Angela; Summanwar, Anand; Breivik, Lars; Hansen, Trond Andreas; Lietaer, Nicolas; Røhne, Ole Myren; Sandaker, Heidi.
Status of 3D detector development at SINTEF for ITk Upgrade. 13th "Trento" Workshop on advanced silicon radiation detectors (TREDI 2018); 2018-02-19 - 2018-02-21
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2016
3 Bleiker, Simon J.; Taklo, Maaike Margrete Visser; Lietaer, Nicolas; Vogl, Andreas; Bakke, Thor; Niklaus, Frank.
Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding. Micromachines 2016 ;Volum 7.(10) s. -
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4 Sugden, Mark W,; Tao, Junlei; Liu, Changqing; Hutt, David A.; Whalley, David C.; Lietaer, Nicolas.
Characterisation of thermocompression bonds formed using metal coated polymer core particles for fine pitch interconnections. I: 2016 6th Electronic System-Integration Technology Conference (ESTC), Grenoble, 13-15 Sept. 2016. IEEE 2016 ISBN 978-1-5090-1403-3. s. -
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2014
5 Lietaer, Nicolas; Summanwar, Anand; Herum, Sara Rund; Nazareno, Leny.
Dry-film resist technology for versatile TSV fabrication for MEMS, tested on blind dummy TSVs. DTIP; 2014-04-01 - 2014-04-04
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6 Lietaer, Nicolas; Summanwar, Anand; Herum, Sara Rund; Nazareno, Leny.
Dry-film resist technology for versatile TSV fabrication for MEMS, tested on blind dummy TSVs. I: Symposium on Design, test, Integration & Packaging of MEMS/MOEMS, Cannes, France, 1-4 April, 2014. EDA Publishing Association 2014 ISBN 9782355000287. s. 351-355
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2012
7 Kok, Angela; Boscardin, M.; Dalla Betta, G-F.; Da Via, Cinzia; Darbo, G.; Fleta, C.; Hansen, Thor-Erik; Hasi, Jasmine; Kenney, Christopher; Lietaer, Nicolas; Lozano, M.; Parker, Sherwood; Pellegrini, G.; Summanwar, Anand.
Results from the first prototype of large 3D active edge sensors. I: 2011 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC): Valencia, 23-29 Oct, 2011. IEEE conference proceedings 2012 ISBN 978-1-4673-0118-3. s. 1319-1323
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8 Tollefsen, Torleif Andre; Taklo, Maaike Margrete Visser; Bakke, Thor; Lietaer, Nicolas; Dalsjø, Per G.; Gakkestad, Jakob.
Reliability of TSV and wafer-level bonding for a 3D integrable SOI based MEMS application. International Wafer-Level Packaging Conference; 2012-11-05 - 2012-11-08
FFI USN SINTEF Untitled
 
9 Tvedt, Lars Geir Whist; Lietaer, Nicolas; Bakke, Thor; Redford, Keith; Kristiansen, Helge.
Wafer-level Bonding using Anisotropic Conductive Adhesive for 3D MEMS Applications. IMAPS 8th International Conference and Exhibition on Device Packaging, Proceedings 2012
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10 Tvedt, Lars Geir Whist; Lietaer, Nicolas; Bakke, Thor; Redford, Keith; Kristiansen, Helge.
Wafer-level Bonding using Anisotropic Conductive Adhesive for 3D MEMS applications. IMAPS 8th International Conference and Exhibition on Device Packaging; 2012-03-05 - 2012-03-08
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2011
11 Grenier, Philippe; Alimonti, G; Barbero, M; Bates, R; Bolle, Erlend; Borri, M; Boscardin, M; Buttar, C; Capua, M; Cavalli-Sforza, M; Cobal, M; Cristofoli, A; Dalla Betta, F; Darbo, G; Da Via, C; Devetak, E; DeWilde, B; Di Girolamo, B; Dobos, D; Einsweiler, K; Esseni, D; Fazio, S; Fleta, C; Freestone, J; Gallrapp, C; Garcia-Sciveres, M; Gariano, G; Gemme, C; Giordani, MP; Gjersdal, Håvard; Grinstein, S; Hansen, Trond Andreas; Hansen, Thor-Erik; Hansson, P; Hasi, J; Helle, Kristine Indahl; Hoeferkamp, M; Hugging, F; Jackson, P; Jakobs, K; Kalliopuska, J; Karagounis, M; Kenney, C; Kohler, M; Kocian, M; Kok, Angela Chun Ying; Kolya, S; Korokolov, I; Kostyukhin, V; Kruger, H; La Rosa, A; Lai, CH; Lietaer, Nicolas; Lozano, M; Mastroberardino, A; Micelli, A; Nellist, C; Oja, A; Oshea, V; Padilla, C; Palestri, P; Parker, S; Parzefall, U; Pater, J; Pellegrini, G; Pernegger, H; Piemonte, C; Pospisil, S; Povoli, M; Roe, S; Røhne, Ole Myren; Ronchin, S; Rovani, A; Ruscino, E; Sandaker, Heidi; Seidel, S; Selmi, L; Silverstein, D; Sjøbæk, Kyrre Ness; Slavicek, T; Stapnes, Steinar; Stugu, Bjarne; Stupak, J; Su, D; Susinno, G; Thompson, R; Tsung, JW; Tsybychev, D; Watts, SJ; Wermes, N; Young, C; Zorzi, N.
Test beam results of 3D silicon pixel sensors for the ATLAS upgrade. Nuclear Instruments and Methods in Physics Research Section A : Accelerators, Spectrometers, Detectors and Associated Equipment 2011 ;Volum 638.(1) s. 33-40
SINTEF UiB UiO Untitled
 
12 Guttormsen, Magne Sveen; Bürger, Alexander; Hansen, Thor-Erik; Lietaer, Nicolas.
The SiRi particle-telescope system. Nuclear Instruments and Methods in Physics Research Section A : Accelerators, Spectrometers, Detectors and Associated Equipment 2011 ;Volum 648.(1) s. 168-173
SINTEF UiO Untitled
 
13 Kok, Angela; Boscardin, M.; Dalla Betta, G.-F.; Da Via, C.; Darbo, G.; Fleta, C.; Hansen, Thor-Erik; Hasi, J.; Kenney, C.; Lietaer, Nicolas; Lozano, M.; Parker, S.I.; Pellegrini, G.; Summanwar, Anand.
Results from the First Prototype of Large 3D Active Edge Sensors. IEEE Nuclear Science Symposium Conference Record 2011 s. 1319-1323
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14 Kok, Angela; Hansen, Thor-Erik; Hansen, Trond Andreas; Lietaer, Nicolas; Summanwar, Anand.
Fabrication of Full 3D Active Edge Sensors. 6th Trento Workshop on Advanced Radiation Detectors (3D and P-type Technologies); 2011-03-02 - 2011-03-04
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15 Koybasi, Ozhan; Alagoz, Enver; Krzywda, Alex; Arndt, Kirk; Bolla, Gina; Bortoletto, Daniela; Hansen, Thor-Erik; Hansen, Trond Andreas; Jensen, Geir Uri; Kok, Angela Chun Ying; Kwan, Simon; Lietaer, Nicolas; Rivera, Ryan; Shipsey, Ian; Uplegger, Lorenzo; Da Via, Cinzia.
Electrical Characterization and Preliminary Beam Test Results of 3D Silicon CMS Pixel Detectors. IEEE Transactions on Nuclear Science 2011 ;Volum 58.(3) s. 1315-1323
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16 Lietaer, Nicolas; Bakke, Thor; Summanwar, Anand; Dalsjø, Per G.; Gakkestad, Jakob; Niklaus, Frank.
Wafer-level packaged MEMS switch with TSV. International Wafer-Level Packaging Conference; 2011-10-03 - 2011-10-06
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17 Lietaer, Nicolas; Summanwar, Anand; Bakke, Thor; Taklo, Maaike Margrete Visser; Dalsjø, Per G..
TSV development for miniaturized MEMS acceleration switch. I: 2010 IEEE International 3D Systems Integration Conference (3DIC), Munich, Germany, 16-18 Nov. 2010. IEEE conference proceedings 2011 ISBN 978-1-4577-0526-7. s. 274-277
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18 Micelli, A.; Helle, Kristine Indahl; Sandaker, Heidi; Stugu, Bjarne; Barbero, M; Hugging, F; Karagounis, M; Kostyukhin, V; Krüger, Harald; Tsung, JW; Wermes, N; Capua, M; Fazio, S; Mastroberardino, A; Susinno, G; Gallrapp, C; Di Girolamo, B; Dobos, D; La Rosa, A; Pernegger, H; Roe, S; Slavicek, T; Pospisil, S; Jakobs, K; Kohler, M; Parzefall, U; Darbo, G; Gariano, G; Gemme, C; Rovani, A; Ruscino, E; Butter, C; Bates, R; Oshea, V; Parker, S; Cavalli-Sforza, M; Grinstein, S; Korokolov, I; Pradilla, C; Einsweiler, K; Garcia-Sciveres, M; Borri, M; Da Via, C; Freestone, J; Kolya, S; Lai, CH; Nellist, C; Pater, J; Thompson, R; Watts, SJ; Hoeferkamp, M; Seidel, S; Gjersdal, Håvard; Sjøbæk, Kyrre Ness; Stapnes, Steinar; Røhne, Ole Myren; Su, D; Young, C; Hansson, P; Grenier, P; Hasi, J; Kenney, C; Kocian, M; Jackson, P; Silverstein, D; Davetak, H; DeWilde, B; Tsybychev, D; Dalla Betta, GF; Gabos, P; Povoli, M; Cobal, M; Giordani, MP; Selmi, L; Cristofoli, A; Esseni, D; Palestri, P; Fleta, C; Lozano, M; Pellegrini, G; Boscardin, M; Bagolini, A; Piemonte, C; Ronchin, S; Zorzi, N; Hansen, Thor-Erik; Hansen, Trond Andreas; Kok, Angela Chun Ying; Lietaer, Nicolas; Kalliopuska, J; Oja, A; Bolle, Erlend.
3D-FBK pixel sensors: Recent beam tests results with irradiated devices. Nuclear Instruments and Methods in Physics Research Section A : Accelerators, Spectrometers, Detectors and Associated Equipment 2011 ;Volum 650.(1) s. 150-157
SINTEF UiB UiO Untitled
 
19 Summanwar, Anand; Lietaer, Nicolas.
Etching buried oxide at the bottom of high aspect ratio structures. Micromechanics and Micro systems Europe Workshop (MME); 2011-06-19 - 2011-06-22
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20 Summanwar, Anand; Lietaer, Nicolas.
Etching Burried Oxide at the Bottom of High Aspect Ratio Structures. I: MME 2011: Proceedings of the 22nd Micromechanics and microsystems technology Europe workshop: 19-22 June 2011 Tønsberg, Norway. Tønsberg: Vestfold University College 2011 ISBN 978-82-7860-224-9. s. 326-329
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2010
21 Kok, Angela; Hansen, Thor-Erik; Hansen, Trond Andreas; Lietaer, Nicolas; Summanwar, Anand; Kenney, CJ; Hasi, Jasmine; Da Via, Cinzia; Parker, Sherwood.
Fabrication of 3D silicon sensors. Proceedings of Science (PoS) 2010 s. -
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22 Kok, Angela; Lietaer, Nicolas.
Fabrication of 3D detectors. Vertex 2010; 2010-06-07 - 2010-06-12
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23 Kok, Angela; Lietaer, Nicolas.
Status of 3D sensors processing at SINTEF MiNaLab. The 5th Trento Workshop on 3D and p-type Sensors; 2010-02-24 - 2010-02-26
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24 Koybasi, Ozhan; Bortoletto, Daniela; Hansen, Thor-Erik; Kok, Angela; Hansen, Trond Andreas; Lietaer, Nicolas; Jensen, Geir Uri; Summanwar, Anand; Bolla, Gino; Kwan, Simon Wing Lok.
Design, Simulation, Fabrication, and Preliminary Tests of 3D CMS Pixel Detectors for the Super-LHC. IEEE Transactions on Nuclear Science 2010 ;Volum 57.(5) s. 2897-2905
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25 Lietaer, Nicolas; Summanwar, Anand; Dalsjø, Per G.; Bakke, Thor; Tofteberg, Hannah Rosquist.
TSV development for miniaturized MEMS acceleration switch. IEEE International 3D System Integration Conference (3DIC); 2010-11-16 - 2010-11-18
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26 Lietaer, Nicolas; Taklo, Maaike M. Visser; Schjølberg-Henriksen, Kari; Ramm, Peter.
(Invited) 3D Interconnect Technologies for Advanced MEMS/NEMS Applications. ECS Transactions 2010 ;Volum 25.(38) s. 87-95
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27 Ramm, Peter; Klumpp, Armin; Weber, Josef; Lietaer, Nicolas; Taklo, Maaike M. Visser; de Raedt, W.; Fritzsch, Thomas; Couderc, Pascal.
3D Integration technology: Status and application development. European Conference on Solid-State Circuits (ESSCIRC) 2010 s. 9-16
NTNU SINTEF Untitled
 
28 Taklo, Maaike Margrete Visser; Mielnik, Michal Marek; Schjølberg-Henriksen, Kari; Storås, Preben; Tofteberg, Hannah Rosquist; Lietaer, Nicolas; Johannessen, Rolf.
Technologies enabling 3D stacking of MEMS. I: Smart Systems Integration and ReliabilityHonory volume on occasion ofHerbert Reichl's 65th birthday. Dresden: Goldenbogen Verlag 2010 ISBN 978-3-932434-77-8. s. 136-145
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29 Taklo, Maaike Margrete Visser; Schjølberg-Henriksen, Kari; Lietaer, Nicolas; Prainsack, Josef; Elfving, Anders; Weber, Josef; Klein, Matthias; Schneider, Peter; Reitz, Sven.
3D Integration of MEMS and IC: Design, Technology and Simulations. I: Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators (NATO Science for Peace and Security Series B: Physics and Biophysics). Springer 2010 ISBN 904813806X. s. 191-203
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2009
30 Hansen, Thor-Erik; Kok, Angela; Hansen, Trond Andreas; Lietaer, Nicolas; Mielnik, Michal Marek; Storas, P; Da'Via, Cinzia; Hasi, Jasmine; Kenney, C; Parker, Sherwood.
First fabrication of full 3D-detectors at SINTEF. Journal of Instrumentation (JINST) 2009 ;Volum 4. s. -
NTNU SINTEF Untitled
 
31 Hansen, Thor-Erik; Kok, Angela; Hansen, Trond Andreas; Lietaer, Nicolas; Jensen, Geir Uri; Summanwar, Anand.
Development and fabrication of full 3D-sensors at SINTEF MiNaLab. Invited Seminar Fermi National Accelerator Laboratory (Fermi Lab) FNAL; 2009-10-21 - 2009-10-21
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32 Hansen, Thor-Erik; Kok, Angela; Hansen, Trond Andreas; Lietaer, Nicolas; Jensen, Geir Uri; Summanwar, Anand.
Latest Results From 2nd SINTEF 3D-Run. 3D-Processing Meeting; 2009-11-26 - 2009-11-26
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33 Hansen, Thor-Erik; Kok, Angela; Hansen, Trond Andreas; Lietaer, Nicolas; Jensen, Geir Uri; Summanwar, Anand.
2nd run of full 3-D detectors. Venice 3D-Detector Processing Meeting; 2009-06-04 - 2009-06-04
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34 Hansen, Thor-Erik; Kok, Angela; Hansen, Trond Andreas; Lietaer, Nicolas; Mielnik, Michal Marek; storås, Preben; Jensen, Geir Uri.
Next lot of 3-D detectors at SINTEF. ATLAS meeting; 2009-01-09 - 2009-01-09
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35 Kok, Angela; Hansen, Thor-Erik; Hansen, Trond Andreas; Jensen, Geir Uri; Lietaer, Nicolas; Mielnik, Michal Marek; Storås, Preben.
High aspect ratio deep RIE for novel 3D radiation sensors in high energy physics applications. IEEE Nuclear Science Symposium Conference Record 2009 s. 1623-1627
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36 Lietaer, Nicolas.
3D MEMS and IC integration. I: 2008 MRS Fall Meeting Symposium E proceedings. Materials Research Society 2009 ISBN 9781605110844.
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37 Lietaer, Nicolas.
3D stacked MEMS and ICs in a miniaturized sensor node. DTIP of MEMS and MOEMS; 2009-04-01 - 2009-04-03
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38 Lietaer, Nicolas.
3D stacked MEMS and ICs in a miniaturized sensor node. I: Design, Test, Integration and Packaging of MEMS/MOEMS 2009. IEEE 2009 ISBN 9782355000096. s. 74-77
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39 Lietaer, Nicolas; Taklo, Maaike M. Visser; Klumpp, Armin; Weber, Josef; Ramm, Peter.
3D Integration Technologies For Miniaturized Tire Pressure Monitor System (TPMS). I: MICROELECTRONICS. INTERNATIONAL SYMPOSIUM. 42ND 2009. (IMAPS 2009). Curran Associates, Inc. 2009 ISBN 9781627480963. s. 822-829
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40 Lietaer, Nicolas; Taklo, Maaike Margrete Visser; Schjølberg-Henriksen, Kari; Ramm, Peter.
3D interconnect technologies for advanced MEMS/NEMS applications. 216th Meeting of the Electrochemical Society; 2009-10-04 - 2009-10-09
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41 Schjølberg-Henriksen, Kari; Taklo, Maaike Margrete Visser; Prainsack, Josef; Dielacher, Markus; Klein, Matthias; Weber, Josef; Lietaer, Nicolas; Seppanen, Timo; Wolf, Jurgen; Ramm, Peter.
Miniaturised sensor node for tire pressure monitoring (e-CUBES). I: Advanced Microsystems for Automotive Applications - Smart systems for safety, sustainability, and comfort. Springer 2009 ISBN 9783642007446. s. 313-332
NTNU SINTEF Untitled
 
2008
42 Hansen, Thor-Erik; Kok, Angela; Lietaer, Nicolas; Hansen, Trond Andreas; Storås, Preben.
Activities at SINTEF. 3D Collaboration Meeting; 2008-07-22 - 2008-07-22
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43 Hansen, Thor-Erik; Lietaer, Nicolas; Kok, Angela.
Report from Processing of 3D-detectors at SINTEF. 3D Meeting; 2008-01-31 - 2008-01-31
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44 Lietaer, Nicolas.
MEMS Sensor/IC Integration for Miniaturized TPMS (e-CUBES). Manufacturing and reliability challenges for 3D Ics using TSVs; 2008-09-25 - 2008-09-26
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45 Lietaer, Nicolas.
3D MEMS and IC Integration. MRS fall meeting (Symposium E: Materials and Technologies for 3-D Integration); 2008-12-01 - 2008-12-05
SINTEF Untitled
 
2007
46 Hansen, Thor-Erik; Lietaer, Nicolas; Kok, Angela; Storås, Preben.
3-D Radiation Detector Project at SINTEF. 3D-detector Work Shop; 2007-09-17 - 2007-09-18
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47 Hansen, Thor-Erik; Lietaer, Nicolas; Storås, Preben; Kok, Angela.
3-D Radiation Detector Activity at SINTEF. ATLAS 3-D Sensor Meeting; 2007-02-28 - 2007-02-28
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48 Hansen, Thor-Erik; Lietaer, Nicolas; Storås, Preben; Kok, Angela.
3-D Radiation Detector Activity at SINTEF. ATLAS 3-D Meeting; 2007-07-02 - 2007-07-02
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2006
49 Hansen, Thor-Erik; Lietaer, Nicolas; Storås, Preben; Kok, Angela.
3-D Radiation Detector Activity at SINTEF. ATLAS Pixel Upgrade Meeting; 2006-12-06 - 2006-12-06
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50 Lietaer, Nicolas; Storås, Preben; Breivik, Lars; Moe, Sigurd T..
Development of cost-effective high-density through-wafer interconnects for 3D microsystems. Journal of Micromechanics and Microengineering (JMM) 2006 ;Volum 16.(6 Spesial Issue)
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