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2017
1 Taklo, Maaike M. Visser; Belle, Branson; Wright, Daniel Nilsen; Vardøy, Astrid-Sofie Borge; Garcia, Alexandre; Eriksson, Torbjörn; Hagel, Olle; Danestig, Magnus.
Smart Tags that are exactly Reliable Enough. I: 2017 Pan Pacific Microelectronics Symposium (Pan Pacific), Kauai, HI, USA, 6-9 Feb. 2017. IEEE 2017 ISBN 978-1-5090-4342-2. s. -
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2 Taklo, Maaike M. Visser; Belle, Branson; Wright, Daniel Nilsen; Vardøy, Astrid-Sofie Borge; Garcia, Alexandre; Eriksson, Torbjörn; Hagel, Olle; Danestig, Magnus.
Smart Tags that are exactly Reliable Enough. Pan Pacific Microelectronics Symposium (Pan Pacific); 2017-01-06 - 2017-01-09
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3 Taklo, Maaike M. Visser; Wright, Daniel Nilsen; Kolberg, Sigbjørn; Vardøy, Astrid-Sofie Borge; Hamou, Faycal Riad; Vogl, Andreas; Bakke, Thor; Kristiansen, Helge; Kalland, Erik.
Hygrothermal aging of flip-chip assembled MOEMS. 13th International Conference and Exhibition on Device Packaging (DPC); 2017-03-07 - 2017-03-09
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4 Vardøy, Astrid-Sofie Borge; Garcia, Alexandre; Wright, Daniel Nilsen; Belle, Branson; Taklo, Maaike M. Visser; Hagel, Olle; Xie, Li; Danestig, Magnus; Eriksson, Torbjörn.
Soldering of components onto a smart tag - an evaluation of the process window. NordPac conference 2017; 2017-06-19 - 2017-06-20
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5 Vardøy, Astrid-Sofie Borge; Garcia, Alexandre; Wright, Daniel Nilsen; Belle, Branson; Taklo, Maaike M. Visser; Hagel, Olle; Xie, Li; Danestig, Magnus; Eriksson, Torbjörn.
Soldering of components onto a smart tag - an evaluation of the process window. I: IMAPS Nordic Annual Conference 2017. International Microelectronics and Packaging Society (IMAPS) Nordic 2017 ISBN 978-1-5108-4668-5. s. 32-37
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6 Wright, Daniel Nilsen; Vardøy, Astrid-Sofie Borge; Belle, Branson; Taklo, Maaike M. Visser; Hagel, Olle; Xie, Li; Danestig, Magnus; Eriksson, Torbjörn.
Bending Machine for Testing Reliability of Flexible Electronics. NordPac conference 2017; 2017-06-19 - 2017-06-20
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7 Wright, Daniel Nilsen; Vardøy, Astrid-Sofie Borge; Belle, Branson; Taklo, Maaike Margrete Visser; Hagel, Olle; Xie, Li; Danestig, Magnus; Eriksson, Torbjörn.
Bending machine for testing reliability of flexible electronics. I: 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac 2017), NORDPAC 2017, Gothenburg, Sweden, 18-20 June 2017. IEEE 2017 ISBN 9781538630563. s. -
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2016
8 Taklo, Maaike Margrete Visser; Belle, Branson; Graff, Joachim Seland; Vardøy, Astrid-Sofie Borge; Ramsdal, Elisabeth Grønn.
Comparison of hermetic sealing using SAC and SnPb solder for a MEMS pressure sensor. 12th International Conference and Exhibition on Device Packaging; 2016-03-15 - 2016-03-17
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9 Vardøy, Astrid-Sofie Borge; Zürcher, Jonas; Brunschwiler, Thomas; Taklo, Maaike Margrete Visser.
All-Cu interconnects by sintered nano copper paste. IMAPS Nordic - International Microelectronics And Packaging Society - Nordic Chapter; 2016-06-05 - 2016-06-07
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10 Zürcher, Jonas; Del Carro, Luca; Schlottig, Gerd; Wright, Daniel Nilsen; Vardøy, Astrid-Sofie Borge; Taklo, Maaike Margrete Visser; Mills, Tobias; Zschenderlein, Uwe; Wunderle, Bernhard; Brunschwiler, Thomas.
All-Copper Flip Chip Interconnects by Pressure-less and Low Temperature Nanoparticle Sintering. The 66th Electronic Components and Technology Conference - ECTC; 2016-05-31 - 2016-06-03
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11 Zürcher, Jonas; Del Carro, Luca; Schlottig, Gerd; Wright, Daniel Nilsen; Vardøy, Astrid-Sofie Borge; Taklo, Maaike Margrete Visser; Mills, Tobias; Zschenderlein, Uwe; Wunderle, Bernhard; Brunschwiler, Thomas.
All-Copper Flip Chip Interconnects by Pressureless and Low Temperature Nanoparticle Sintering. I: 2016 IEEE 66th Proceedings Electronic Components and Technology Conference (ECTC), Las Vegas, May 31 2016-June 3 2016. IEEE 2016 ISBN 978-1-5090-1204-6. s. 343-349
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2015
12 Brunschwiler, Thomas; Zürcher, Jonas; Schlottig, Gerd; Mills, Tobias; Reip, Paul; Taklo, Maaike Margrete Visser; Vardøy, Astrid-Sofie Borge; Wright, Daniel Nilsen; Baum, Mario; Kumar, Sridhar; Zschenderlein, Uwe; Wunderle, Bernhard.
Low Temperature All-Copper Interconnects by Nanoparticle Assembly and Sintering. The Global Interposer Technology 2015 Workshop; 2015-11-04 - 2015-11-07
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13 Dixon, Richard N.; Yu, Kerry; Vardøy, Astrid-Sofie Borge; Taklo, Maaike Margrete Visser; Zürcher, Jonas; Brunschwiler, Thomas.
Copper Ink/Paste Considerations for the Formation of Interconnects. The 20th European Microelectronics and Packaging Conference (EMPC); 2015-09-14 - 2015-09-16
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14 Dixon, Richard N.; Yu, Kerry; Vardøy, Astrid-Sofie Borge; Taklo, Maaike Margrete Visser; Zürcher, Jonas; Brunschwiler, Thomas.
Nano-Inks Enabling Low Temperature All-Copper Interconnects. EPIT webinar at IBM; 2015-03-20 - 2015-03-20
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15 Hamou, Faycal Riad; Wright, Daniel Nilsen; Vardøy, Astrid-Sofie Borge; Haupt, Marie; Helland, Susanne; Kristiansen, Helge; Taklo, Maaike Margrete Visser.
Analyzing thermo-mechanical reliability of an interconnect based on metal coated polymer spheres (MPS). 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2015); 2015-04-19 - 2015-04-22
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16 Hamou, Faycal Riad; Wright, Daniel Nilsen; Vardøy, Astrid-Sofie Borge; Haupt, Marie; Helland, Susanne; Kristiansen, Helge; Taklo, Maaike Margrete Visser.
Analyzing thermo-mechanical reliability of an interconnect based on metal coated polymer spheres (MPS). I: 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems 2015 (EuroSimE), Budapest. 19-22 April 2015. IEEE conference proceedings 2015 ISBN 978-1-4799-9949-1. s. -
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17 Luu, Thi Thuy; Høivik, Nils Deneke; Wang, Kaiying; Aasmundtveit, Knut Eilif; Vardøy, Astrid-Sofie Borge.
Characterization of wafer-level au-in-bonded samples at elevated temperatures. Metallurgical and Materials Transactions A 2015 ;Volum 46.(6) s. 2637-2645
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18 Luu, Thi Thuy; Høivik, Nils Deneke; Wang, Kaiying; Aasmundtveit, Knut Eilif; Vardøy, Astrid-Sofie Borge.
High-temperature mechanical integrity of Cu-Sn SLID wafer-level bonds. Metallurgical and Materials Transactions A 2015 ;Volum 46.(11) s. 5266-5274
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19 Taklo, Maaike Margrete Visser; Wright, Daniel Nilsen; Vardøy, Astrid-Sofie Borge; Attard, Alastair; Hajdarevic, Zlatko; Bulacher, Stephan; Saliba, Mario; Wijgaerts, Jan; Borg, Joshua; Vella, David Oscar.
Thermomechanical Reliability of Gold Stud Bump Bonding for Large Volume MEMS Devices. I: 2015 IEEE 65th Electronic Components and Technology Conference (ECTC 2015), San Diego, California, USA, 26-29 May 2015. IEEE 2015 ISBN 978-1-4799-8610-1. s. 1357-1364
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20 Taklo, Maaike Margrete Visser; Wright, Daniel Nilsen; Vardøy, Astrid-Sofie Borge; Attard, Alastair; Hajdarevic, Zlatko; Bulacher, Stephan; Saliba, Mario; Wijgaerts, Jan; Borg, Joshua; Vella, David Oscar.
Thermomechanical reliability of gold stud bump bonding for large volume MEMS devices. Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th; 2015-05-26 - 2015-05-29
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21 Vardøy, Astrid-Sofie Borge; Wright, Daniel Nilsen; Taklo, Maaike Margrete Visser; Zürcher, Jonas; Brunschwiler, Thomas; Kumar, Sridhar; Dixon, Richard N.; Yu, Kerry.
All-Copper Interconnects for Homogeneous and Heterogeneous Assemblies. The 20th European Microelectronics and Packaging Conference (EMPC); 2015-09-14 - 2015-09-16
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22 Wiggen, Øystein; Austad, Hanne Opsahl; Færevik, Hilde; Seeberg, Trine Margrethe; Vardøy, Astrid-Sofie Borge.
Intelligent clothing for extreme weather. http://sciencenordic.com/intelligent-clothing-extreme-weathe [Internett] 2015-09-04
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23 Wiggen, Øystein; Austad, Hanne Opsahl; Færevik, Hilde; Seeberg, Trine Margrethe; Vardøy, Astrid-Sofie Borge.
Utvikler smarte klær til ekstremvær. http://www.nrk.no/trondelag/utvikler-smarte-klaer-til-ekstre [Internett] 2015-08-01
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24 Wiggen, Øystein; Færevik, Hilde; Austad, Hanne Opsahl; Seeberg, Trine Margrethe; Vardøy, Astrid-Sofie Borge.
Utvikler intelligente ekstremklær. http://gemini.no/2015/07/utvikler-intelligente-ekstremklaer/ [Internett] 2015-07-20
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2014
25 Aasmundtveit, Knut Eilif; Luu, Thi Thuy; Vardøy, Astrid-Sofie Borge; Tollefsen, Torleif Andre; Wang, Kaiying; Hoivik, Nils.
High-temperature shear strength of solid-liquid interdiffusion (SLID) bonding: Cu-Sn, Au-Sn and Au-In. I: Electronics System-Integration Technology Conference (ESTC), 2014, Helsinki. 16-18 Sept. 2014. IEEE conference proceedings 2014 ISBN 978-1-4799-4025-7. s. -
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26 Seeberg, Trine Margrethe; Vedum, Jon; Sandsund, Mariann; Austad, Hanne Opsahl; Liverud, Anders Erik; Vardøy, Astrid-Sofie Borge; Svagård, Ingrid Storruste; Strisland, Frode.
Development of a wearable multisensor device enabling continuous monitoring of vital signs and activity. I: Biomedical and Health Informatics. IEEE-EMBS International Conference. 2014. (BHI 2014), Valencia, Spain, 1-4 June 2014. IEEE Press 2014 ISBN 9781479921324. s. 213-218
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27 Seeberg, Trine Margrethe; Vedum, Jon; Sandsund, Mariann; Austad, Hanne Opsahl; Liverud, Anders Erik; Vardøy, Astrid-Sofie Borge; Svagård, Ingrid Storruste; Strisland, Frode.
Development of a wearable multisensor device enabling continuous monitoring of vital signs and activity. 2014 IEEE-EMBS International Conference on Biomedical and Health Informatics (BHI 2014); 2014-06-01 - 2014-06-04
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28 Taklo, Maaike Margrete Visser; Vardøy, Astrid-Sofie Borge; Attard, Alastair; Hajdarevic, Zlatko; Bulacher, Stephan; Saliba, Mario; Wijgaerts, Jan; Borg, Joshua; Vella, David Oscar.
NCP versus NCF for thermocompression MEMS bonding using gold stud bumps. International Wafer Level Packaging Conference (IWLPC); 2014-11-11 - 2014-11-13
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29 Vardøy, Astrid-Sofie Borge; van de Wiel, H. J.; Martinsen, Stian; Hayes, G.; Fischer, H.; Aasmundtveit, Knut E.; Lapadatu, Adriana; Taklo, Maaike Margrete Visser.
Void formation and bond strength investigated for wafer-level Cu-Sn Solid-Liquid Interdiffusion (SLID) bonding. Journal of Microelectronics and Electronic Packaging 2014 ;Volum 11.(1) s. 1-6
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30 Wright, Daniel Nilsen; Vardøy, Astrid-Sofie Borge; Taklo, Maaike Margrete Visser; Helge, Kristiansen.
Metal coated polymer spheres for compliant fine pitch ball grid arrays. 2014 IEEE International conference on 3D integration (3DIC); 2014-12-01 - 2014-12-03
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2013
31 Benjaminsen, Christina; Seeberg, Trine Margrethe; Wiggen, Øystein; Færevik, Hilde; Vardøy, Astrid-Sofie Borge; Austad, Hanne Opsahl.
Ekstreme arbeidsforhold. Gemini [Fagblad] 2013-03-04
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32 Benjaminsen, Christina; Seeberg, Trine Margrethe; Wiggen, Øystein; Vardøy, Astrid-Sofie Borge; Færevik, Hilde; Austad, Hanne Opsahl.
Ekstreme arbeidsklær. Forskning.no : nettavis med nyheter fra norsk og internasjon [Fagblad] 2013-03-06
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33 Lapadatu, Adriana; Martinsen, Stian; Kittilsland, Gjermund; Vardøy, Astrid-Sofie Borge; Luu, Thi Thuy; Høivik, Nils.
Wafer level vacuum encapsulation for uncooled microbolometers. WaferBond'13; 2013-12-05 - 2013-12-06
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34 Meinhold, Bridgette; Seeberg, Trine Margrethe; Vardøy, Astrid-Sofie Borge; Færevik, Hilde; Austad, Hanne Opsahl; Wiggen, Øystein.
Norwegian Scientists Develop “Smart” Clothes for Arctic Workers. Ecouterre [Internett] 2013-03-19
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35 Seeberg, Trine Margrethe; Færevik, Hilde; Wiggen, Øystein; Vardøy, Astrid-Sofie Borge.
Denne jakken overvåker helsen din. NRK [TV] 2013-03-13
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36 Seeberg, Trine Margrethe; Færevik, Hilde; Wiggen, Øystein; Vardøy, Astrid-Sofie Borge.
Smart jacket to monitor Arctic workers' health. Engineering and Technology Magazine [Fagblad] 2013-03-11
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37 Seeberg, Trine Margrethe; Vardøy, Astrid-Sofie Borge; Austad, Hanne Opsahl; Wiggen, Øystein; Stenersen, Henning Seeberg; Liverud, Anders Erik; Storholmen, Tore Christian B.; Færevik, Hilde.
Protective Jacket Enabling Decision Support for Workers in Cold Climate. IEEE Engineering in Medicine and Biology Society. Conference Proceedings 2013 ;Volum 35. s. 6498-6501
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38 Seeberg, Trine Margrethe; Vardøy, Astrid-Sofie Borge; Færevik, Hilde; Wiggen, Øystein; Austad, Hanne Opsahl.
Smart jacket for Arctic workers. More inspiration [Internett] 2013-03-19
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39 Seeberg, Trine Margrethe; Vardøy, Astrid-Sofie Borge; Taklo, Maaike Margrete Visser; Austad, Hanne Opsahl.
Decision Support for Subjects Exposed to Heat Stress. IEEE journal of biomedical and health informatics 2013 ;Volum 17.(2) s. 402-410
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40 Seeberg, Trine Margrethe; Vardøy, Astrid-Sofie Borge; Taklo, Maaike Margrete Visser; Austad, Hanne Opsahl.
Stress alarm for smoke-divers. Gemini [Fagblad] 2013-04-22
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41 Szondy, David; Seeberg, Trine Margrethe; Vardøy, Astrid-Sofie Borge; Austad, Hanne Opsahl; Wiggen, Øystein; Færevik, Hilde.
ColdWear project developing smart jacket for workers in the Arctic. Gizmag [Fagblad] 2013-03-14
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42 Taklo, Maaike Margrete Visser; Vardøy, Astrid-Sofie Borge; De Wolf, Ingrid; Simons, Veerle; van de Wiel, H. J.; van der Waal, Adri; Lapadatu, Adriana; Martinsen, Stian; Wunderle, Bernhard.
Residual stress in silicon caused by Cu-Sn wafer-level packaging. InterPACK2013-73317; 2013-07-16 - 2013-07-18
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43 van de Wiel, H. J.; Vardøy, Astrid-Sofie Borge; Hayes, G.; Kouters, M.H.M.; van der Waal, Adri; Erinc, M.; Lapadatu, Adriana; Martinsen, Stian; Taklo, Maaike Margrete Visser; Fischer, H.R..
Systematic characterization of key parameters of hermetic wafer-level Cu-Sn SLID bonding. I: 19th European Microelectronics and Packaging Conference, EMPC 2013, Grenoble; France; 9 September 2013 through 12 September 2013. IEEE conference proceedings 2013 ISBN 9782952746717. s. -
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44 van de Wiel, H. J.; Vardøy, Astrid-Sofie Borge; Hayes, G.; Kouters, M.H.M.; van der Waal, Adri; Erinc, M.; Lapadatu, Adriana; Martinsen, Stian; Taklo, Maaike Margrete Visser; Fischer, H.R..
Systematic characterization of key parameters of hermetic waferlevel Cu-Sn SLID bonding. European Microelectronics and Packaging Conference; 2013-09-09 - 2013-09-12
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45 Vardøy, Astrid-Sofie Borge.
Sensorer i system. Lektor 2 for 2 Fy ved Dønski v.g.s.; 2013-03-10 - 2013-03-10
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46 Vardøy, Astrid-Sofie Borge; Larsson, Andreas; Gislerud, Knut Olav Halgrim; Bhatti, Hamzah; Imenes, Kristin; Seeberg, Trine Margrethe.
Stretchable Conductors Enabled by Metal Coated Polymer Spheres. IEEE Sensors Journal 2013 ;Volum 13.(10) s. 4049-4055
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47 Vardøy, Astrid-Sofie Borge; Seeberg, Trine Margrethe; Larsson, Andreas.
Stretchable Conductors enabled by Metal Coated Polymer Spheres. FlexStretch 2013; 2013-11-12 - 2013-11-13
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48 Vardøy, Astrid-Sofie Borge; van de Wiel, H. J.; Martinsen, Stian; Hayes, G.; Fischer, H.; Aasmundtveit, Knut E.; Lapadatu, Adriana; Taklo, Maaike Margrete Visser.
Void formation and bond strength investigated for wafer-level Cu-Sn SLID bonding. 46th International symposium on microelectronics, IMAPS 2013; 2013-09-30 - 2013-10-03
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2012
49 Larsson, Andreas; Vardøy, Astrid-Sofie Borge; Oldervoll, Frøydis; Storstrøm, Olav Barros; Mielnik, Michal Marek; Dalton, Eric; Mahmood, Kafil; Min, Deokki; Taklo, Maaike Margrete Visser.
Interconnects and Substrates for Thermal Considerations. Thermal and Thermomechanical (ITherm); 2012-05-30 - 2012-06-01
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50 Larsson, Andreas; Vardøy, Astrid-Sofie Borge; Oldervoll, Frøydis; Storstrøm, Olav Barros; Mielnik, Michal Marek; Dalton, Eric; Mahmood, Kafil; Min, Deokki; Taklo, Maaike Margrete Visser.
Interconnects and substrates for thermal considerations. I: 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm, San Diego, CA, May 30 2012-June 1 2012. IEEE conference proceedings 2012 ISBN 978-1-4244-9533-7. s. 235-244
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