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2011
1 Liu, He; Salomonsen, Guttorm; Wang, Kaiying; Aasmundtveit, Knut E.; Høivik, Nils.
Wafer-level Cu/Sn to Cu/Sn SLID-bonded interconnects with increased strength. IEEE Transactions on Components, Packaging, and Manufacturing Technology 2011 ;Volum 1.(9) s. 1350-1358
USN Untitled
 
2010
2 Høivik, Nils; Liu, He; Wang, Kaiying; Salomonsen, Guttorm; Aasmundtveit, Knut E..
High-temperature stable Au-Sn and Cu-Sn interconnects for 3D stacked applications : advanced processes and materials. I: Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators. Springer Science+Business Media B.V. 2010 ISBN 978-90-481-3807-4. s. 179-190
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3 Høivik, Nils; Wang, Kaiying; Aasmundtveit, Knut E.; Salomonsen, Guttorm; Lapadatu, Adriana; Kittilsland, Gjermund; Stark, Birger.
Fluxless wafer-level Cu-Sn bonding for micro- and nanosystems packaging. I: Electronic System-Integration Technology Conference (ESTC), 2010 3rd. IEEE conference proceedings 2010 ISBN 978-1-4244-8554-3. s. -
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4 Lapadatu, Adriana; Simonsen, Tor Ivar; Kittilsland, Gjermund; Stark, Birger; Høivik, Nils; Dalsrud, Vegar; Salomonsen, Guttorm.
Cu-Sn Wafer Level Bonding for Vacuum Encapsulation of Microbolometer Focal Plane Arrays. ECS Transactions 2010 ;Volum 33.(4) s. 73-82
USN Untitled
 
5 Wang, Kaiying; Høivik, Nils; Salomonsen, Guttorm; Aasmundtveit, Knut E..
A simple method for evaluating hermeticity of wafer-level metallic bonding. Micronano System Worskshop (MSW2010); 2010-05-04 - 2010-05-05
USN Untitled