Current Research Information SysTem In Norway
 
 

 English version


 
Hovedside
Forskningsresultater/NVI
Forskere
Prosjekter
Forskningsenheter
Logg inn
Om Cristin
 
 
   
Eksporter til


Viser treff 1-50 av 252 << Forrige 1 2 3 4 5 6    Neste >>

2023
1 Do, Nu Bich Duyen; Imenes, Kristin; Aasmundtveit, Knut Eilif; Nguyen, Hoang-Vu; Andreassen, Erik.
Thermal Conductivity and Mechanical Properties of Polymer Composites with Hexagonal Boron Nitride—A Comparison of Three Processing Methods: Injection Moulding, Powder Bed Fusion and Casting. Polymers 2023 ;Volum 15.(6) s. -
USN SINTEF Untitled
 
2 Do, Nu Bich Duyen; Imenes, Kristin; Aasmundtveit, Knut Eilif; Nguyen, Hoang-Vu; Andreassen, Erik.
Thermally conductive polymer composites with hexagonal boron nitride for medical device thermal management. The 24th European Microelectronics & Packaging Conference (EMPC 2023); 2023-09-11 - 2023-09-14
USN NTNU Untitled
 
3 Hernandez Gonzalez, Lisette; Aasmundtveit, Knut Eilif; Nguyen, Hoang-Vu.
Low-Temperature Cu–(Sn–Bi) Solid Liquid Interdiffusion Bonding – An Initial Study. I: 2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac). IEEE (Institute of Electrical and Electronics Engineers) 2023 ISBN 978-91-89821-06-4. s. -
USN Untitled
 
4 Hernandez Gonzalez, Lisette; Aasmundtveit, Knut Eilif; Nguyen, Hoang-Vu.
Low-Temperature Cu–(Sn–Bi) Solid Liquid Interdiffusion Bonding – An Initial Study. 2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac); 2023-06-12 - 2023-06-14
USN NTNU Untitled
 
5 Huynh, Van Long; Aasmundtveit, Knut Eilif; Nguyen, Hoang-Vu.
Flip-chip interconnects based on single metal-coated polymer spheres. The 24th European Microelectronics & Packaging Conference and Exhibition (EMPC 2023); 2023-09-11 - 2023-09-14
USN NTNU Untitled
 
6 Kuziora, Stephane; Nguyen, Hoang-Vu; Aasmundtveit, Knut Eilif.
Ag–(In–Bi) solid-state bonding. Journal of materials science. Materials in electronics 2023 ;Volum 34.(16) s. -
USN Untitled
 
7 Nguyen, Thanh-Phuc; Xia, Hexin; Aasmundtveit, Knut Eilif; Nguyen, Hoang-Vu.
Impact of MEMS Release Process on The Integrity of Cu–Sn SLID Bonds in Vacuum Packaging of Microbolometer Array. 2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac); 2023-06-12 - 2023-06-14
USN NTNU Untitled
 
8 Roy, Avisek; Aasmundtveit, Knut Eilif.
Carbon Nanotube Growth on the Polysilicon Layers of CMOS. IEEE International Conference on Nanotechnology 2023 (23) s. -
USN Untitled
 
9 Roy, Avisek; Aasmundtveit, Knut Eilif.
Carbon Nanotube Growth on the Polysilicon Layers of CMOS. IEEE International Conference on Nanotechnology 2023; 2023-07-02 - 2023-07-05
USN NTNU Untitled
 
10 Roy, Avisek; Ta, Bao Quoc; Azadmehr, Mehdi; Aasmundtveit, Knut Eilif.
Post-CMOS processing challenges and design developments of CMOS-MEMS microheaters for local CNT synthesis. Microsystems & Nanoengineering 2023 ;Volum 9. s. -
USN Untitled
 
11 Wernicke, Tobias; Rebhan, Bernhard; Vuorinen, Vesa; Paulasto-Krockel, Mervi; Dubey, Vikas; Diex, Kevin; Wünsch, Dirk; Baum, Mario; Wiemer, Maik; Tanaka, Shuji; Froemel, Joerg; Aasmundtveit, Knut Eilif; Nguyen, Hoang-Vu; Dragoi, Viorel.
Recent Developments in Low Temperature Wafer Level Metal Bonding for Heterogenous Integration. ECS Transactions 2023 ;Volum 112.(3) s. 247-263
USN Untitled
 
2022
12 Aasmundtveit, Knut Eilif; Wang, Changhai; Rencz, Márta; Paulasto-Krockel, Mervi; Imenes, Kristin; Desmulliez, Marc P.Y.; Ender, Ferenc; Vuorinen, Vesa.
Joint International Master in Smart Systems Integrated Solutions. I: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC): September 13th -16th 2022, Sibiu, Romania Conference Proceedings. IEEE conference proceedings 2022 ISBN 978-1-6654-8947-8. s. 310-314
USN Untitled
 
13 Huynh, Van Long; Aasmundtveit, Knut Eilif; Nguyen, Hoang-Vu.
Selective Deposition of Conductive Particles for Anisotropic Conductive Adhesive Interconnects. 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC); 2022-09-13 - 2022-09-16
USN NTNU Untitled
 
14 Huynh, Van Long; Aasmundtveit, Knut Eilif; Nguyen, Hoang-Vu.
Selective Deposition of Conductive Particles for Anisotropic Conductive Adhesive Interconnects. I: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC): September 13th -16th 2022, Sibiu, Romania Conference Proceedings. IEEE conference proceedings 2022 ISBN 978-1-6654-8947-8. s. 124-128
USN Untitled
 
15 Kuziora, Stephane; Nguyen, Hoang-Vu; Aasmundtveit, Knut.
Ag-(In-Bi) Solid–Liquid Interdiffusion Bonding. Journal of Electronic Materials 2022 s. -
USN Untitled
 
16 Nguyen, Hoang-Vu; Kuziora, Stephane; Aasmundtveit, Knut Eilif.
Au-(In-Bi) and Ag-(In-Bi) Metallic Bonding for Temperature Sensitive Materials. I: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC): September 13th -16th 2022, Sibiu, Romania Conference Proceedings. IEEE conference proceedings 2022 ISBN 978-1-6654-8947-8. s. 373-378
USN Untitled
 
17 Nguyen, Hoang-Vu; Kuziora, Stephane; Aasmundtveit, Knut Eilif.
Au-(In-Bi) and Ag-(In-Bi) Metallic Bonding for Temperature Sensitive Materials. 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC); 2022-09-13 - 2022-09-16
USN NTNU Untitled
 
18 Roy, Avisek; Nguyen, Hoang Vu; Xia, Hexin; Papatzacos, Phillip; Øhlckers, Per Alfred; Aasmundtveit, Knut Eilif.
Vacuum Packaging of MEMS-based Infrared Detectors. I: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC): September 13th -16th 2022, Sibiu, Romania Conference Proceedings. IEEE conference proceedings 2022 ISBN 978-1-6654-8947-8. s. -
USN Untitled
 
19 Roy, Avisek; Nguyen, Hoang-Vu; Xia, Hexin; Papatzacos, Phillip; Øhlckers, Per; Aasmundtveit, Knut Eilif.
Vacuum Packaging of MEMS-based Infrared Detectors. 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC); 2022-09-13 - 2022-09-16
USN UiO NTNU Untitled
 
20 Xia, Hexin; Roy, Avisek; Nguyen, Hoang-Vu; Ramic, Zekija; Aasmundtveit, Knut Eilif; Øhlckers, Per.
Failure Analysis of Fabrication Process in Hermetic Wafer-level Packaging for Microbolometer Focal Plane Arrays. 33rd European Symposium on Reliability of Electron Devices Failure Physics and Analysis; 2022-09-26 - 2022-09-29
NTNU UiO USN Untitled
 
21 Xia, Hexin; Roy, Avisek; Nguyen, Hoang-Vu; Ramic, Zekija; Aasmundtveit, Knut; Øhlckers, Per.
Failure analysis of fabrication process in hermetic wafer-level packaging for microbolometer focal plane arrays. Microelectronics and reliability 2022 ;Volum 138. s. -
USN Untitled
 
2021
22 Aasmundtveit, Knut Eilif; Wang, Changhai; Rencz, Márta; Paulasto-Krockel, Mervi; Imenes, Kristin; Desmulliez, Marc P.Y.; Ender, Ferenc; Vuorinen, Vesa.
Joint International Master in Smart Systems Integrated Solutions. I: Proceedings Smart Systems Integration April 27–29, 2021 International Conference and Exhibition on Smart Systems Integration. IEEE 2021 ISBN 978-1-6654-4092-9. s. 40-43
USN Untitled
 
23 Aasmundtveit, Knut Eilif; Wang, Changhai; Rencz, Márta; Paulasto-Krockel, Mervi; Imenes, Kristin; Desmulliez, Marc P.Y.; Ender, Ferenc; vuorinen, vesa.
Joint International Master in Smart Systems Integrated Solutions. 2021 Smart Systems Integration (SSI); 2021-04-27 - 2021-04-29
USN Untitled
 
24 Do, Nu Bich Duyen; Andreassen, Erik; Edwardsen, Stephen; Lifjeld, Anders; Aasmundtveit, Knut; Nguyen, Hoang-Vu; Imenes, Kristin.
Thermal management of an interventional medical device with double layer encapsulation. Experimental heat transfer 2021 s. -
USN SINTEF Untitled
 
25 Kuziora, Stephane; Aasmundtveit, Knut Eilif; Nguyen, Hoang-Vu.
Ni–Sn SLID bonds for assembly at extremely high temperatures. European Microelectronics and Packaging Conference and Exhibition; 2021-09-13 - 2021-09-16
USN NTNU Untitled
 
26 Kuziora, Stephane; Nguyen, Hoang-Vu; Aasmundtveit, Knut Eilif.
Ni–Sn SLID bonds for assembly at extremely high temperatures. I: Proceedings of 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE 2021 ISBN 978-0-9568086-7-7. s. -
USN Untitled
 
27 Nguyen, Hoang-Vu; Hernandez Gonzalez, Lisette; Imenes, Kristin; Aasmundtveit, Knut Eilif.
Enabling Low-Temperature Reworkability for Anisotropic Conductive Adhesives. 2021 23rd European Microelectronics and Packaging Conference (EMPC); 2021-09-13 - 2021-09-16
USN NTNU Untitled
 
28 Nguyen, Hoang-Vu; Hernandez Gonzalez, Lisette; Imenes, Kristin; Aasmundtveit, Knut Eilif.
Enabling Low-Temperature Reworkability for Anisotropic Conductive Adhesives. I: Proceedings of 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE (Institute of Electrical and Electronics Engineers) 2021 ISBN 978-0-9568086-7-7. s. -
USN Untitled
 
29 Papatzacos, Phillip; Tiwary, Nikhilendu; Hoivik, Nils; Nguyen, Hoang-Vu; Roy, Avisek; Aasmundtveit, Knut Eilif.
Investigation of seal frame geometry on Sn squeeze-out in Cu-Sn SLID bonds. I: Proceedings of 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE 2021 ISBN 978-0-9568086-7-7. s. -
USN Untitled
 
30 Papatzacos, Phillip; Tiwary, Nikhilendu; Nils, Hoivik; Nguyen, Huang Vu; Roy, Avisek; Aasmundtveit, Knut.
Investigation of seal frame geometry on Sn squeeze-out in Cu-Sn SLID bonds. 23rd European Microelectronics and Packaging Conference and Exhibition (EMPC2021); 2021-09-13 - 2021-09-16
USN NTNU Untitled
 
31 Xia, Hexin; Akram, Muhammad Nadeem; Roy, Avisek; Bardalen, Eivind; Nguyen, Hoang Vu; Hoivik, Nils; Aasmundtveit, Knut Eilif; Ohlckers, Per.
Design of Silicon Cap for Hermetic Packaging of Microbolometer Focal Plane Arrays. IEEE Transactions on Components, Packaging, and Manufacturing Technology 2021 ;Volum 12.(3) s. 429-436
USN Untitled
 
32 Xia, Hexin; Roy, Avisek; Bardalen, Eivind; Nguyen, Hoang Vu; Aasmundtveit, Knut Eilif; Øhlckers, Per Alfred.
Impact of Micromachining Process on Cu-Sn Solid-Liquid Interdiffusion (SLID) Bonds. 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC); 2021-09-13 - 2021-09-16
NTNU USN Untitled
 
33 Xia, Hexin; Roy, Avisek; Bardalen, Eivind; Nguyen, Hoang-Vu; Aasmundtveit, Knut Eilif; Øhlckers, Per.
Impact of Micromachining Process on Cu-Sn Solid-Liquid Interdiffusion (SLID) Bonds. I: Proceedings of 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE 2021 ISBN 978-0-9568086-7-7. s. -
USN Untitled
 
2020
34 Aasmundtveit, Knut Eilif; Imenes, Kristin; Svasta, Paul M..
Welcome. 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) 2020 s. -
USN Untitled
 
35 Aasmundtveit, Knut; Imenes, Kristin; Svasta, Paul M..
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC). IEEE (Institute of Electrical and Electronics Engineers) 2020 (ISBN 978-1-7281-6293-5) 300 s.
USN Untitled
 
36 Aasmundtveit, Knut; Roy, Avisek; Ta, Bao Quoc.
Direct Integration of Carbon Nanotubes in CMOS, towards an Industrially Feasible Process: A Review. IEEE transactions on nanotechnology 2020 ;Volum 19. s. 113-122
USN Untitled
 
37 Bolstad, Per Kristian; Kuziora, Stephane; Nguyen, Hoang-Vu; Manh, Tung; Aasmundtveit, Knut; Hoff, Lars.
Impact of High Pressures on Au-Sn Solid Liquid Interdiffusion (SLID) Bonds. Electronics System-Integration Technology Conference; 2020-09-15 - 2020-09-15
USN NTNU Untitled
 
38 Bolstad, Per Kristian; Kuziora, Stephane; Nguyen, Hoang-Vu; Manh, Tung; Aasmundtveit, Knut; Hoff, Lars.
Impact of High Pressures on Au-Sn Solid Liquid Interdiffusion (SLID) Bonds. I: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC). IEEE 2020 ISBN 978-1-7281-6293-5. s. -
USN Untitled
 
39 Kuziora, Stephane; Nguyen, Hoang-Vu; Bolstad, Per Kristian; Aasmundtveit, Knut.
Bi Behaviour in Au–(In–Bi) SLID Bonding. I: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC). IEEE 2020 ISBN 978-1-7281-6293-5. s. -
USN Untitled
 
40 Kuziora, Stephane; Nguyen, Hoang-Vu; Bolstad, Per Kristian; Aasmundtveit, Knut.
Bi Behaviour in Au–(In–Bi) SLID Bonding. 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC); 2020-09-15 - 2020-09-18
USN NTNU Untitled
 
41 Larsson, Andreas; Aasmundtveit, Knut.
On the Microstructure of Off-Eutectic Au-Ge Joints: A High-Temperature Joint. Metallurgical and Materials Transactions A 2020 ;Volum 51.(2) s. 740-749
USN Untitled
 
42 Nguyen, Hoang-Vu; Kristiansen, Helge; Imenes, Kristin; Aasmundtveit, Knut.
Peel Adhesion and Reworkability of Anisotropic Conductive Adhesive for Flex-to-Flex Assembly in Medical Devices. 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC); 2020-09-15 - 2020-09-18
USN Untitled
 
43 Nguyen, Hoang-Vu; Kristiansen, Helge; Imenes, Kristin; Aasmundtveit, Knut.
Peel Adhesion and Reworkability of Anisotropic Conductive Adhesive for Flex-to-Flex Assembly in Medical Devices. I: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC). IEEE 2020 ISBN 978-1-7281-6293-5. s. -
USN Untitled
 
44 Roy, Avisek; Marchetti, Luca; Azadmehr, Mehdi; Häfliger, Philipp; Ta, Bao Quoc; Aasmundtveit, Knut.
Characterization of Polysilicon Microstructures to Estimate Local Temperature on CMOS Chips. I: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC). IEEE 2020 ISBN 978-1-7281-6293-5. s. -
USN UiO Untitled
 
45 Xia, Hexin; Akram, Muhammad Nadeem; Bardalen, Eivind; Roy, Avisek; Aasmundtveit, Knut; Øhlckers, Per.
Evaluation of Silicon Diaphragms for Hermetic Packaging of Microbolometer Arrays. I: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC). IEEE 2020 ISBN 978-1-7281-6293-5. s. -
USN Untitled
 
2019
46 Aasmundtveit, Knut; Luu, Thi Thuy; Nguyen, Hoang-Vu; Larsson, Andreas; Tollefsen, Torleif Andre.
Solid-liquid InterDiffusion (SLID) Bonding, for Thermally Challenging Applications. I: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC). IEEE conference proceedings 2019 ISBN 978-1-7281-1499-6.
USN Untitled
 
47 Aasmundtveit, Knut; Roy, Avisek; Ta, Bao Quoc.
Carbon nanotubes directly integrated in CMOS by local synthesis-Towards a wafer-level process. I: 2018 IEEE 13th Nanotechnology Materials and Devices Conference (NMDC). IEEE (Institute of Electrical and Electronics Engineers) 2019 ISBN 9781538610169. s. -
USN Untitled
 
48 Aasmundtveit, Knut; Tekseth, Kim Robert Bjørk; Breiby, Dag Werner; Nguyen, Hoang-Vu.
High-energy X-ray Tomography for 3D Void Characterization in Au–Sn Solid-Liquid Interdiffusion (SLID) Bonds. 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC); 2019-09-17 - 2019-09-19
USN NTNU Untitled
 
49 Aasmundtveit, Knut; Tekseth, Kim Robert Bjørk; Breiby, Dag Werner; Nguyen, Hoang-Vu.
High-energy x-ray tomography for 3d void characterization in au-sn solid-liquid interdiffusion (SLID) bonds. I: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE conference proceedings 2019 ISBN 978-0-9568086-6-0. s. -
USN NTNU Untitled
 
50 Do, Nu Bich Duyen; Andreassen, Erik; Edwardsen, Stephen; Lifjeld, Anders; Nguyen, Hoang-Vu; Aasmundtveit, Knut; Imenes, Kristin.
New Encapsulation Concepts for Medical Ultrasound Probes – A Heat Transfer Simulation Study. 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC); 2019-09-17 - 2019-09-19
USN SINTEF Untitled
 
    Vis neste liste