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English
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2023
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1. |
Do, Nu Bich Duyen; Imenes, Kristin; Aasmundtveit, Knut Eilif; Nguyen, Hoang-Vu; Andreassen, Erik. Thermal Conductivity and Mechanical Properties of Polymer Composites with Hexagonal Boron Nitride—A Comparison of Three Processing Methods: Injection Moulding, Powder Bed Fusion and Casting. Polymers 2023 ;Volum 15.(6) s. - USN SINTEF
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2. |
Do, Nu Bich Duyen; Imenes, Kristin; Aasmundtveit, Knut Eilif; Nguyen, Hoang-Vu; Andreassen, Erik. Thermally conductive polymer composites with hexagonal boron nitride for medical device thermal management. The 24th European Microelectronics & Packaging Conference (EMPC 2023); 2023-09-11 - 2023-09-14 USN NTNU
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3. |
Hernandez Gonzalez, Lisette; Aasmundtveit, Knut Eilif; Nguyen, Hoang-Vu. Low-Temperature Cu–(Sn–Bi) Solid Liquid Interdiffusion Bonding – An Initial Study. I: 2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac). IEEE (Institute of Electrical and Electronics Engineers) 2023 ISBN 978-91-89821-06-4. s. - USN
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Hernandez Gonzalez, Lisette; Aasmundtveit, Knut Eilif; Nguyen, Hoang-Vu. Low-Temperature Cu–(Sn–Bi) Solid Liquid Interdiffusion Bonding – An Initial Study. 2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac); 2023-06-12 - 2023-06-14 USN NTNU
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Huynh, Van Long; Aasmundtveit, Knut Eilif; Nguyen, Hoang-Vu. Flip-chip interconnects based on single metal-coated polymer spheres. The 24th European Microelectronics & Packaging Conference and Exhibition (EMPC 2023); 2023-09-11 - 2023-09-14 USN NTNU
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6. |
Kuziora, Stephane; Nguyen, Hoang-Vu; Aasmundtveit, Knut Eilif. Ag–(In–Bi) solid-state bonding. Journal of materials science. Materials in electronics 2023 ;Volum 34.(16) s. - USN
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7. |
Nguyen, Thanh-Phuc; Xia, Hexin; Aasmundtveit, Knut Eilif; Nguyen, Hoang-Vu. Impact of MEMS Release Process on The Integrity of Cu–Sn SLID Bonds in Vacuum Packaging of Microbolometer Array. 2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac); 2023-06-12 - 2023-06-14 USN NTNU
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Roy, Avisek; Aasmundtveit, Knut Eilif. Carbon Nanotube Growth on the Polysilicon Layers of CMOS. IEEE International Conference on Nanotechnology 2023 (23) s. - USN
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9. |
Roy, Avisek; Aasmundtveit, Knut Eilif. Carbon Nanotube Growth on the Polysilicon Layers of CMOS. IEEE International Conference on Nanotechnology 2023; 2023-07-02 - 2023-07-05 USN NTNU
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10. |
Roy, Avisek; Ta, Bao Quoc; Azadmehr, Mehdi; Aasmundtveit, Knut Eilif. Post-CMOS processing challenges and design developments of CMOS-MEMS microheaters for local CNT synthesis. Microsystems & Nanoengineering 2023 ;Volum 9. s. - USN
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11. |
Wernicke, Tobias; Rebhan, Bernhard; Vuorinen, Vesa; Paulasto-Krockel, Mervi; Dubey, Vikas; Diex, Kevin; Wünsch, Dirk; Baum, Mario; Wiemer, Maik; Tanaka, Shuji; Froemel, Joerg; Aasmundtveit, Knut Eilif; Nguyen, Hoang-Vu; Dragoi, Viorel. Recent Developments in Low Temperature Wafer Level Metal Bonding for Heterogenous Integration. ECS Transactions 2023 ;Volum 112.(3) s. 247-263 USN
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2022
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12. |
Aasmundtveit, Knut Eilif; Wang, Changhai; Rencz, Márta; Paulasto-Krockel, Mervi; Imenes, Kristin; Desmulliez, Marc P.Y.; Ender, Ferenc; Vuorinen, Vesa. Joint International Master in Smart Systems Integrated Solutions. I: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC): September 13th -16th 2022, Sibiu, Romania Conference Proceedings. IEEE conference proceedings 2022 ISBN 978-1-6654-8947-8. s. 310-314 USN
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13. |
Huynh, Van Long; Aasmundtveit, Knut Eilif; Nguyen, Hoang-Vu. Selective Deposition of Conductive Particles for Anisotropic Conductive Adhesive Interconnects. 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC); 2022-09-13 - 2022-09-16 USN NTNU
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14. |
Huynh, Van Long; Aasmundtveit, Knut Eilif; Nguyen, Hoang-Vu. Selective Deposition of Conductive Particles for Anisotropic Conductive Adhesive Interconnects. I: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC): September 13th -16th 2022, Sibiu, Romania Conference Proceedings. IEEE conference proceedings 2022 ISBN 978-1-6654-8947-8. s. 124-128 USN
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15. |
Kuziora, Stephane; Nguyen, Hoang-Vu; Aasmundtveit, Knut. Ag-(In-Bi) Solid–Liquid Interdiffusion Bonding. Journal of Electronic Materials 2022 s. - USN
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16. |
Nguyen, Hoang-Vu; Kuziora, Stephane; Aasmundtveit, Knut Eilif. Au-(In-Bi) and Ag-(In-Bi) Metallic Bonding for Temperature Sensitive Materials. I: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC): September 13th -16th 2022, Sibiu, Romania Conference Proceedings. IEEE conference proceedings 2022 ISBN 978-1-6654-8947-8. s. 373-378 USN
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17. |
Nguyen, Hoang-Vu; Kuziora, Stephane; Aasmundtveit, Knut Eilif. Au-(In-Bi) and Ag-(In-Bi) Metallic Bonding for Temperature Sensitive Materials. 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC); 2022-09-13 - 2022-09-16 USN NTNU
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18. |
Roy, Avisek; Nguyen, Hoang Vu; Xia, Hexin; Papatzacos, Phillip; Øhlckers, Per Alfred; Aasmundtveit, Knut Eilif. Vacuum Packaging of MEMS-based Infrared Detectors. I: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC): September 13th -16th 2022, Sibiu, Romania Conference Proceedings. IEEE conference proceedings 2022 ISBN 978-1-6654-8947-8. s. - USN
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19. |
Roy, Avisek; Nguyen, Hoang-Vu; Xia, Hexin; Papatzacos, Phillip; Øhlckers, Per; Aasmundtveit, Knut Eilif. Vacuum Packaging of MEMS-based Infrared Detectors. 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC); 2022-09-13 - 2022-09-16 USN UiO NTNU
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20. |
Xia, Hexin; Roy, Avisek; Nguyen, Hoang-Vu; Ramic, Zekija; Aasmundtveit, Knut Eilif; Øhlckers, Per. Failure Analysis of Fabrication Process in Hermetic Wafer-level Packaging for Microbolometer Focal Plane Arrays. 33rd European Symposium on Reliability of Electron Devices Failure Physics and Analysis; 2022-09-26 - 2022-09-29 NTNU UiO USN
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21. |
Xia, Hexin; Roy, Avisek; Nguyen, Hoang-Vu; Ramic, Zekija; Aasmundtveit, Knut; Øhlckers, Per. Failure analysis of fabrication process in hermetic wafer-level packaging for microbolometer focal plane arrays. Microelectronics and reliability 2022 ;Volum 138. s. - USN
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2021
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22. |
Aasmundtveit, Knut Eilif; Wang, Changhai; Rencz, Márta; Paulasto-Krockel, Mervi; Imenes, Kristin; Desmulliez, Marc P.Y.; Ender, Ferenc; Vuorinen, Vesa. Joint International Master in Smart Systems Integrated Solutions. I: Proceedings Smart Systems Integration April 27–29, 2021 International Conference and Exhibition on Smart Systems Integration. IEEE 2021 ISBN 978-1-6654-4092-9. s. 40-43 USN
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23. |
Aasmundtveit, Knut Eilif; Wang, Changhai; Rencz, Márta; Paulasto-Krockel, Mervi; Imenes, Kristin; Desmulliez, Marc P.Y.; Ender, Ferenc; vuorinen, vesa. Joint International Master in Smart Systems Integrated Solutions. 2021 Smart Systems Integration (SSI); 2021-04-27 - 2021-04-29 USN
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24. |
Do, Nu Bich Duyen; Andreassen, Erik; Edwardsen, Stephen; Lifjeld, Anders; Aasmundtveit, Knut; Nguyen, Hoang-Vu; Imenes, Kristin. Thermal management of an interventional medical device with double layer encapsulation. Experimental heat transfer 2021 s. - USN SINTEF
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25. |
Kuziora, Stephane; Aasmundtveit, Knut Eilif; Nguyen, Hoang-Vu. Ni–Sn SLID bonds for assembly at extremely high temperatures. European Microelectronics and Packaging Conference and Exhibition; 2021-09-13 - 2021-09-16 USN NTNU
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26. |
Kuziora, Stephane; Nguyen, Hoang-Vu; Aasmundtveit, Knut Eilif. Ni–Sn SLID bonds for assembly at extremely high temperatures. I: Proceedings of 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE 2021 ISBN 978-0-9568086-7-7. s. - USN
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27. |
Nguyen, Hoang-Vu; Hernandez Gonzalez, Lisette; Imenes, Kristin; Aasmundtveit, Knut Eilif. Enabling Low-Temperature Reworkability for Anisotropic Conductive Adhesives. 2021 23rd European Microelectronics and Packaging Conference (EMPC); 2021-09-13 - 2021-09-16 USN NTNU
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28. |
Nguyen, Hoang-Vu; Hernandez Gonzalez, Lisette; Imenes, Kristin; Aasmundtveit, Knut Eilif. Enabling Low-Temperature Reworkability for Anisotropic Conductive Adhesives. I: Proceedings of 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE (Institute of Electrical and Electronics Engineers) 2021 ISBN 978-0-9568086-7-7. s. - USN
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29. |
Papatzacos, Phillip; Tiwary, Nikhilendu; Hoivik, Nils; Nguyen, Hoang-Vu; Roy, Avisek; Aasmundtveit, Knut Eilif. Investigation of seal frame geometry on Sn squeeze-out in Cu-Sn SLID bonds. I: Proceedings of 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE 2021 ISBN 978-0-9568086-7-7. s. - USN
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30. |
Papatzacos, Phillip; Tiwary, Nikhilendu; Nils, Hoivik; Nguyen, Huang Vu; Roy, Avisek; Aasmundtveit, Knut. Investigation of seal frame geometry on Sn squeeze-out in Cu-Sn SLID bonds. 23rd European Microelectronics and Packaging Conference and Exhibition (EMPC2021); 2021-09-13 - 2021-09-16 USN NTNU
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31. |
Xia, Hexin; Akram, Muhammad Nadeem; Roy, Avisek; Bardalen, Eivind; Nguyen, Hoang Vu; Hoivik, Nils; Aasmundtveit, Knut Eilif; Ohlckers, Per. Design of Silicon Cap for Hermetic Packaging of Microbolometer Focal Plane Arrays. IEEE Transactions on Components, Packaging, and Manufacturing Technology 2021 ;Volum 12.(3) s. 429-436 USN
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32. |
Xia, Hexin; Roy, Avisek; Bardalen, Eivind; Nguyen, Hoang Vu; Aasmundtveit, Knut Eilif; Øhlckers, Per Alfred. Impact of Micromachining Process on Cu-Sn Solid-Liquid Interdiffusion (SLID) Bonds. 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC); 2021-09-13 - 2021-09-16 NTNU USN
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33. |
Xia, Hexin; Roy, Avisek; Bardalen, Eivind; Nguyen, Hoang-Vu; Aasmundtveit, Knut Eilif; Øhlckers, Per. Impact of Micromachining Process on Cu-Sn Solid-Liquid Interdiffusion (SLID) Bonds. I: Proceedings of 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE 2021 ISBN 978-0-9568086-7-7. s. - USN
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2020
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34. |
Aasmundtveit, Knut Eilif; Imenes, Kristin; Svasta, Paul M.. Welcome. 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) 2020 s. - USN
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35. |
Aasmundtveit, Knut; Imenes, Kristin; Svasta, Paul M.. 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC). IEEE (Institute of Electrical and Electronics Engineers) 2020 (ISBN 978-1-7281-6293-5) 300 s. USN
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36. |
Aasmundtveit, Knut; Roy, Avisek; Ta, Bao Quoc. Direct Integration of Carbon Nanotubes in CMOS, towards an Industrially Feasible Process: A Review. IEEE transactions on nanotechnology 2020 ;Volum 19. s. 113-122 USN
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37. |
Bolstad, Per Kristian; Kuziora, Stephane; Nguyen, Hoang-Vu; Manh, Tung; Aasmundtveit, Knut; Hoff, Lars. Impact of High Pressures on Au-Sn Solid Liquid Interdiffusion (SLID) Bonds. Electronics System-Integration Technology Conference; 2020-09-15 - 2020-09-15 USN NTNU
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38. |
Bolstad, Per Kristian; Kuziora, Stephane; Nguyen, Hoang-Vu; Manh, Tung; Aasmundtveit, Knut; Hoff, Lars. Impact of High Pressures on Au-Sn Solid Liquid Interdiffusion (SLID) Bonds. I: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC). IEEE 2020 ISBN 978-1-7281-6293-5. s. - USN
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39. |
Kuziora, Stephane; Nguyen, Hoang-Vu; Bolstad, Per Kristian; Aasmundtveit, Knut. Bi Behaviour in Au–(In–Bi) SLID Bonding. I: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC). IEEE 2020 ISBN 978-1-7281-6293-5. s. - USN
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40. |
Kuziora, Stephane; Nguyen, Hoang-Vu; Bolstad, Per Kristian; Aasmundtveit, Knut. Bi Behaviour in Au–(In–Bi) SLID Bonding. 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC); 2020-09-15 - 2020-09-18 USN NTNU
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41. |
Larsson, Andreas; Aasmundtveit, Knut. On the Microstructure of Off-Eutectic Au-Ge Joints: A High-Temperature Joint. Metallurgical and Materials Transactions A 2020 ;Volum 51.(2) s. 740-749 USN
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42. |
Nguyen, Hoang-Vu; Kristiansen, Helge; Imenes, Kristin; Aasmundtveit, Knut. Peel Adhesion and Reworkability of Anisotropic Conductive Adhesive for Flex-to-Flex Assembly in Medical Devices. 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC); 2020-09-15 - 2020-09-18 USN
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43. |
Nguyen, Hoang-Vu; Kristiansen, Helge; Imenes, Kristin; Aasmundtveit, Knut. Peel Adhesion and Reworkability of Anisotropic Conductive Adhesive for Flex-to-Flex Assembly in Medical Devices. I: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC). IEEE 2020 ISBN 978-1-7281-6293-5. s. - USN
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44. |
Roy, Avisek; Marchetti, Luca; Azadmehr, Mehdi; Häfliger, Philipp; Ta, Bao Quoc; Aasmundtveit, Knut. Characterization of Polysilicon Microstructures to Estimate Local Temperature on CMOS Chips. I: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC). IEEE 2020 ISBN 978-1-7281-6293-5. s. - USN UiO
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45. |
Xia, Hexin; Akram, Muhammad Nadeem; Bardalen, Eivind; Roy, Avisek; Aasmundtveit, Knut; Øhlckers, Per. Evaluation of Silicon Diaphragms for Hermetic Packaging of Microbolometer Arrays. I: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC). IEEE 2020 ISBN 978-1-7281-6293-5. s. - USN
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2019
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Aasmundtveit, Knut; Luu, Thi Thuy; Nguyen, Hoang-Vu; Larsson, Andreas; Tollefsen, Torleif Andre. Solid-liquid InterDiffusion (SLID) Bonding, for Thermally Challenging Applications. I: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC). IEEE conference proceedings 2019 ISBN 978-1-7281-1499-6. USN
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47. |
Aasmundtveit, Knut; Roy, Avisek; Ta, Bao Quoc. Carbon nanotubes directly integrated in CMOS by local synthesis-Towards a wafer-level process. I: 2018 IEEE 13th Nanotechnology Materials and Devices Conference (NMDC). IEEE (Institute of Electrical and Electronics Engineers) 2019 ISBN 9781538610169. s. - USN
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48. |
Aasmundtveit, Knut; Tekseth, Kim Robert Bjørk; Breiby, Dag Werner; Nguyen, Hoang-Vu. High-energy X-ray Tomography for 3D Void Characterization in Au–Sn Solid-Liquid Interdiffusion (SLID) Bonds. 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC); 2019-09-17 - 2019-09-19 USN NTNU
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49. |
Aasmundtveit, Knut; Tekseth, Kim Robert Bjørk; Breiby, Dag Werner; Nguyen, Hoang-Vu. High-energy x-ray tomography for 3d void characterization in au-sn solid-liquid interdiffusion (SLID) bonds. I: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE conference proceedings 2019 ISBN 978-0-9568086-6-0. s. - USN NTNU
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50. |
Do, Nu Bich Duyen; Andreassen, Erik; Edwardsen, Stephen; Lifjeld, Anders; Nguyen, Hoang-Vu; Aasmundtveit, Knut; Imenes, Kristin. New Encapsulation Concepts for Medical Ultrasound Probes – A Heat Transfer Simulation Study. 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC); 2019-09-17 - 2019-09-19 USN SINTEF
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