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2020
1 Løvvik, Ole Martin; Graff, Joachim Seland; Schrade, Matthias; Sunding, Martin Fleissner; Wright, Daniel Nilsen; Song, Xin; Finstad, Terje; Enebakk, Erik; Tollefsen, Torleif Andre; Skomedal, Gunstein.
Silicide module produced in the TESil project. Talk at University of Oslo; 2020-03-09
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2 Ali, Ayaz; Koybasi, Ozhan; Xing, Wen; Wright, Daniel Nilsen; Varandani, Deepak; Taniguchi, Takashi; Watanabe, Kenji; Mehta, Bodh R.; Belle, Branson.
Single digit parts-per-billion NOx detection using MoS2/hBN transistors. Sensors and Actuators A-Physical 2020 ;Volum 315. s. -
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2019
3 Ali, Ayaz; Koybasi, Ozhan; Xing, Wen; Muniz, Marta B.; Wright, Daniel Nilsen; Ferber, Alain Marc C; Taniguchi, Takashi; Watanabe, Kenji; Belle, Branson.
NOx detection by MoS2/hBN heterostructures. Graphene Week 2019; 2019-09-23 - 2019-09-27
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4 Koybasi, Ozhan; Ali, Ayaz; Xing, Wen; Wright, Daniel Nilsen; Muniz, Marta B.; Belle, Branson.
Gas sensors based on 2D heterostructures. Norwegian NanoSymposium; 2019-10-16 - 2019-10-17
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5 Sordo, Guido; Wright, Daniel Nilsen; Moe, Sigurd T.; collini, cristian.
Through Silicon Vias in MEMS packaging, a review. NordPac 2019; 2019-06-11 - 2019-06-13
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6 Wright, Daniel Nilsen; Belle, Branson; Graff, Joachim Seland.
Development of mechanically compliant flip chip interconnect using single metal coated polymer spheres. European Microelectronics and Packaging Conference (EMPC2019); 2019-09-16 - 2019-09-19
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7 Wright, Daniel Nilsen; Belle, Branson; Graff, Joachim Seland.
Development of mechanically compliant flip chip interconnect using single metal coated polymer spheres. I: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE conference proceedings 2019 ISBN 978-0-9568086-6-0.
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2018
8 Galeckas, Augustinas; Almeida Carvalho, Patricia; Ma, Quanbao; Azarov, Alexander; Hovden, Sigurd Slettemark; Thøgersen, Annett; Wright, Daniel Nilsen; Diplas, Spyridon; Løvvik, Ole Martin; Jokubavicius, Valdas; Sun, Jianwu; Syväjärvi, Mikael; Svensson, Bengt Gunnar.
Optical and microstructural investigation of heavy B-doping effects in sublimation-grown 3C-SiC. Materials Science Forum 2018 ;Volum 924. s. 221-224
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9 Wright, Daniel Nilsen; Kristiansen, Helge; Gakkestad, Jakob; Hagel, Olle.
Reliability of Conductive Adhesives for IoT. NordPac 2019; 2018-06-12 - 2018-06-14
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2017
10 Gakkestad, Jakob; Sollund, Tomas; Dalsjø, Per G.; Tveit, Bjørn; Taklo, Maaike Margrete Visser; Wright, Daniel Nilsen; Helland, Susanne; Kristiansen, Helge; Johnsen, Christian.
A 2.5-D Integrated Data Logger for Measuring Extreme Accelerations. IEEE Transactions on Components, Packaging, and Manufacturing Technology 2017 ;Volum 7.(12) s. 1930-1939
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11 Ma, Quanbao; Carvalho, Patricia; Galeckas, Augustinas; Azarov, Alexander; Hovden, Sigurd Slettemark; Thøgersen, Annett; Wright, Daniel Nilsen; Diplas, Spyridon; Løvvik, Ole Martin; Jokubavicius, Valdas; Sun, Jianwu; Syväjärvi, Mikael; Svensson, Bengt Gunnar.
Characterization of B-implanted 3C-SiC for intermediate band solar cells. Materials Science Forum 2017 ;Volum 897. s. 299-302
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12 Taklo, Maaike M. Visser; Belle, Branson; Wright, Daniel Nilsen; Vardøy, Astrid-Sofie Borge; Garcia, Alexandre; Eriksson, Torbjörn; Hagel, Olle; Danestig, Magnus.
Smart Tags that are exactly Reliable Enough. I: 2017 Pan Pacific Microelectronics Symposium (Pan Pacific), Kauai, HI, USA, 6-9 Feb. 2017. IEEE 2017 ISBN 978-1-5090-4342-2. s. -
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13 Taklo, Maaike M. Visser; Belle, Branson; Wright, Daniel Nilsen; Vardøy, Astrid-Sofie Borge; Garcia, Alexandre; Eriksson, Torbjörn; Hagel, Olle; Danestig, Magnus.
Smart Tags that are exactly Reliable Enough. Pan Pacific Microelectronics Symposium (Pan Pacific); 2017-01-06 - 2017-01-09
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14 Taklo, Maaike M. Visser; Wright, Daniel Nilsen; Kolberg, Sigbjørn; Vardøy, Astrid-Sofie Borge; Hamou, Faycal Riad; Vogl, Andreas; Bakke, Thor; Kristiansen, Helge; Kalland, Erik.
Hygrothermal aging of flip-chip assembled MOEMS. 13th International Conference and Exhibition on Device Packaging (DPC); 2017-03-07 - 2017-03-09
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15 Vardøy, Astrid-Sofie Borge; Garcia, Alexandre; Wright, Daniel Nilsen; Belle, Branson; Taklo, Maaike M. Visser; Hagel, Olle; Xie, Li; Danestig, Magnus; Eriksson, Torbjörn.
Soldering of components onto a smart tag - an evaluation of the process window. NordPac conference 2017; 2017-06-19 - 2017-06-20
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16 Vardøy, Astrid-Sofie Borge; Garcia, Alexandre; Wright, Daniel Nilsen; Belle, Branson; Taklo, Maaike M. Visser; Hagel, Olle; Xie, Li; Danestig, Magnus; Eriksson, Torbjörn.
Soldering of components onto a smart tag - an evaluation of the process window. I: IMAPS Nordic Annual Conference 2017. International Microelectronics and Packaging Society (IMAPS) Nordic 2017 ISBN 978-1-5108-4668-5. s. 32-37
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17 Wright, Daniel Nilsen; Vardøy, Astrid-Sofie Borge; Belle, Branson; Taklo, Maaike M. Visser; Hagel, Olle; Xie, Li; Danestig, Magnus; Eriksson, Torbjörn.
Bending Machine for Testing Reliability of Flexible Electronics. NordPac conference 2017; 2017-06-19 - 2017-06-20
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18 Wright, Daniel Nilsen; Vardøy, Astrid-Sofie Borge; Belle, Branson; Taklo, Maaike Margrete Visser; Hagel, Olle; Xie, Li; Danestig, Magnus; Eriksson, Torbjörn.
Bending machine for testing reliability of flexible electronics. I: 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac 2017), NORDPAC 2017, Gothenburg, Sweden, 18-20 June 2017. IEEE 2017 ISBN 9781538630563. s. -
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2016
19 Gakkestad, Jakob; Opland, Ottar; dalsjø, Per G.; Helland, Susanne; Kristiansen, Helge; Taklo, Maaike Margrete Visser; Wright, Daniel Nilsen.
Use of Soldered or Glued PCSB as Interconnection between PCB and Ceramic Package in Harsh Environment. 2016 IMAPS Nordic Conference; 2016-06-05 - 2016-06-07
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20 Helland, Susanne; Kalland, Erik; Kristiansen, Helge; Gakkestad, Jakob; Opland, Ottar; dalsjø, Per G.; Taklo, Maaike Margrete Visser; Wright, Daniel Nilsen.
Use of silver-coated polymer particles in isotropic conductive adhesives for electronics applications. 2016 IMAPS Nordic Conference; 2016-06-05 - 2016-06-07
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21 Ma, Quanbao; Carvalho, Patricia; Galeckas, Augustinas; Azarov, Alexander; Hovden, Sigurd; Thøgersen, Annett; Wright, Daniel Nilsen; Diplas, Spyridon; Løvvik, Ole Martin; Jokubavicius, Valdas; Sun, Jianwu; Syväjärvi, Mikael; Svensson, Bengt Gunnar.
Characterization of B-implanted 3C-SiC for intermediate band solar cells. 11th European Conference on Silicon Carbide and Related Materials (ECSCRM) 2016; 2016-09-25 - 2016-09-29
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22 Ma, Quanbao; Galeckas, Augustinas; Azarov, Alexander; Thøgersen, Annett; Carvalho, Patricia; Wright, Daniel Nilsen; Diplas, Spyridon; Løvvik, Ole Martin; Jokubavicius, Valdas; Liu, Xinyu; Sun, Jianwu; Syväjärvi, Mikael; Svensson, Bengt Gunnar.
Boron-implanted 3C-SiC for intermediate band solar cells. Materials Science Forum 2016 ;Volum 858. s. 291-294
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23 Syväjärvi, Mikael; Ma, Quanbao; Jokubavicius, Valdas; Galeckas, Augustinas; Sun, Jianwu; Liu, Xinyu; Jansson, Mattias; Wellmann, Peter; Linnarsson, Margareta; Runde, Paal; Johansen, Bertil; Thøgersen, Annett; Diplas, Spyridon; Carvalho, Patricia; Løvvik, Ole Martin; Wright, Daniel Nilsen; Azarov, Alexander; Svensson, Bengt Gunnar.
Cubic silicon carbide as a potential photovoltaic material. Solar Energy Materials and Solar Cells 2016 ;Volum 145. s. 104-108
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24 Taklo, Maaike Margrete Visser; Wright, Daniel Nilsen; Graff, Joachim Seland; Carvalho, Patricia; Austad, Hanne Opsahl; Dalsjø, Per G.; Gakkestad, Jakob; Ishida, Hiroya; Johnsen, Christian.
Reliability of Plastic Core Solder Balls in relation to formation of intermetallic compounds. I: 2016 6th Electronic System-Integration Technology Conference (ESTC), Grenoble, 13-15 Sept. 2016. IEEE 2016 ISBN 978-1-5090-1403-3. s. -
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25 Taklo, Maaike Margrete Visser; Wright, Daniel Nilsen; Graff, Joachim Seland; Carvalho, Patricia; Opsahl, Hanne Olstad; dalsjø, Per G.; Gakkestad, Jakob; Ishida, Hiroya; Johnsen, Christian.
Reliability of Plastic Core Solder Balls in relation to formation of intermetallic compounds. 6th Electronics System-Integration Technology Conference; 2016-09-13 - 2019-09-16
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26 Wright, Daniel Nilsen; Belle, Branson; Schjølberg-Henriksen, Kari; Nguyen, Hoang-Vu; Gakkestad, Jakob; Kristiansen, Helge; Taklo, Maaike M. Visser.
Anisotropic conductive film for fine-pitch interconnects. Proceedings of the International Symposium on Microelectronics 2016 ;Volum 2016.(1) s. -
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27 Wright, Daniel Nilsen; Taklo, Maaike Margrete Visser; Belle, Branson; Kristiansen, Helge; Gakkestad, Jakob; Nguyen, Hoang-Vu; Schjølberg-Henriksen, Kari.
Anisotropic conductive film for fine-pitch interconnects. IMAPS 2016; 2016-10-10 - 2016-10-13
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28 Zürcher, Jonas; Del Carro, Luca; Schlottig, Gerd; Wright, Daniel Nilsen; Vardøy, Astrid-Sofie Borge; Taklo, Maaike Margrete Visser; Mills, Tobias; Zschenderlein, Uwe; Wunderle, Bernhard; Brunschwiler, Thomas.
All-Copper Flip Chip Interconnects by Pressure-less and Low Temperature Nanoparticle Sintering. The 66th Electronic Components and Technology Conference - ECTC; 2016-05-31 - 2016-06-03
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29 Zürcher, Jonas; Del Carro, Luca; Schlottig, Gerd; Wright, Daniel Nilsen; Vardøy, Astrid-Sofie Borge; Taklo, Maaike Margrete Visser; Mills, Tobias; Zschenderlein, Uwe; Wunderle, Bernhard; Brunschwiler, Thomas.
All-Copper Flip Chip Interconnects by Pressureless and Low Temperature Nanoparticle Sintering. I: 2016 IEEE 66th Proceedings Electronic Components and Technology Conference (ECTC), Las Vegas, May 31 2016-June 3 2016. IEEE 2016 ISBN 978-1-5090-1204-6. s. 343-349
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2015
30 Brunschwiler, Thomas; Zürcher, Jonas; Schlottig, Gerd; Mills, Tobias; Reip, Paul; Taklo, Maaike Margrete Visser; Vardøy, Astrid-Sofie Borge; Wright, Daniel Nilsen; Baum, Mario; Kumar, Sridhar; Zschenderlein, Uwe; Wunderle, Bernhard.
Low Temperature All-Copper Interconnects by Nanoparticle Assembly and Sintering. The Global Interposer Technology 2015 Workshop; 2015-11-04 - 2015-11-07
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31 Hamou, Faycal Riad; Wright, Daniel Nilsen; Vardøy, Astrid-Sofie Borge; Haupt, Marie; Helland, Susanne; Kristiansen, Helge; Taklo, Maaike Margrete Visser.
Analyzing thermo-mechanical reliability of an interconnect based on metal coated polymer spheres (MPS). 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2015); 2015-04-19 - 2015-04-22
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32 Hamou, Faycal Riad; Wright, Daniel Nilsen; Vardøy, Astrid-Sofie Borge; Haupt, Marie; Helland, Susanne; Kristiansen, Helge; Taklo, Maaike Margrete Visser.
Analyzing thermo-mechanical reliability of an interconnect based on metal coated polymer spheres (MPS). I: 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems 2015 (EuroSimE), Budapest. 19-22 April 2015. IEEE conference proceedings 2015 ISBN 978-1-4799-9949-1. s. -
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33 Ma, Quanbao; Galeckas, Augustinas; Azarov, Alexander; Thøgersen, Annett; Carvalho, Patricia; Wright, Daniel Nilsen; Diplas, Spyros; Løvvik, Ole Martin; Jokubavicius, Valdas; Liu, Xinyu; Sun, Jianwu; Syväjärvi, Mikael; Svensson, Bengt Gunnar.
Boron‐implanted 3C‐SiC for intermediate band solar cells. 16th International Conference on Silicon Carbide and Related Materials; 2015-10-04 - 2015-10-09
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34 Taklo, Maaike Margrete Visser; Wright, Daniel Nilsen; Vardøy, Astrid-Sofie Borge; Attard, Alastair; Hajdarevic, Zlatko; Bulacher, Stephan; Saliba, Mario; Wijgaerts, Jan; Borg, Joshua; Vella, David Oscar.
Thermomechanical Reliability of Gold Stud Bump Bonding for Large Volume MEMS Devices. I: 2015 IEEE 65th Electronic Components and Technology Conference (ECTC 2015), San Diego, California, USA, 26-29 May 2015. IEEE 2015 ISBN 978-1-4799-8610-1. s. 1357-1364
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35 Taklo, Maaike Margrete Visser; Wright, Daniel Nilsen; Vardøy, Astrid-Sofie Borge; Attard, Alastair; Hajdarevic, Zlatko; Bulacher, Stephan; Saliba, Mario; Wijgaerts, Jan; Borg, Joshua; Vella, David Oscar.
Thermomechanical reliability of gold stud bump bonding for large volume MEMS devices. Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th; 2015-05-26 - 2015-05-29
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36 Vardøy, Astrid-Sofie Borge; Wright, Daniel Nilsen; Taklo, Maaike Margrete Visser; Zürcher, Jonas; Brunschwiler, Thomas; Kumar, Sridhar; Dixon, Richard N.; Yu, Kerry.
All-Copper Interconnects for Homogeneous and Heterogeneous Assemblies. The 20th European Microelectronics and Packaging Conference (EMPC); 2015-09-14 - 2015-09-16
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37 Wright, Daniel Nilsen; Taklo, Maaike Margrete Visser; Kristiansen, Helge; Baum, Mario; Hoffman, Christian.
Novel compliant fine pitch interconnect using Metal Coated Polymer Spheres. IMAPS Nordic 2015; 2015-06-08 - 2015-06-09
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2014
38 Wright, Daniel Nilsen; Vardøy, Astrid-Sofie Borge; Taklo, Maaike Margrete Visser; Helge, Kristiansen.
Metal coated polymer spheres for compliant fine pitch ball grid arrays. 2014 IEEE International conference on 3D integration (3DIC); 2014-12-01 - 2014-12-03
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2013
39 Taklo, Maaike Margrete Visser; Graff, Joachim Seland; Wright, Daniel Nilsen; Kristiansen, Helge; Hoff, Lars; Waaler, Knut.
Failure Analysis Of Thermally And Mechanically Stressed Plastic Core Solder Balls. 2013 Electronic Components & Technology Conference; 2013-05-28 - 2013-05-31
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40 Taklo, Maaike Margrete Visser; Graff, Joachim Seland; Wright, Daniel Nilsen; Kristiansen, Helge; Hoff, Lars; Waaler, Knut.
Failure analysis of thermally and mechanically stressed plastic core solder balls. I: Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd, 28-31 May 2013, Las Vegas, NV. IEEE conference proceedings 2013 ISBN 978-1-4799-0233-0. s. 748-754
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2008
41 Nilsen, Daniel.
Optical and passivating properties of hydrogenated amorphous silicon nitride deposited by plasma enhanced chemical vapour deposition for applicaton on silicon solar cells. : Det matematisk naturvitenskapelige fakultet, Universitetet i Oslo 2008 154 s.
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2007
42 Breivik, Tallak Harald; Diplas, Spyridon; Ulyashin, A. G.; Gunnæs, Anette Eleonora; Olaisen, Birger Retterstøl; Holt, Arve; Olsen, Arne; Wright, Daniel Nilsen.
Nano-structural properties of ZnO films for Si based heterojunction solar cells. Thin Solid Films 2007 ;Volum 515. s. 8479-8483
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43 Diplas, Spyridon; Ulyashin, Alexander; Maknys, Kestutis; Gunnæs, Anette Eleonora; Jørgensen, Sissel; Watts, J.F.; Olsen, Arne; Finstad, Terje; Wright, Daniel Nilsen.
On the processing-structure-property relationship of ITO layers deposited on crystalline and amorphous Si. Thin Solid Films 2007 ;Volum 515. s. 8539-8543
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2005
44 Bentzen, Andreas; Ulyashin, Alexander; Suphellen, Aina; Sauar, Erik; Grambole, Dieter; Wright, Daniel Nilsen; Marstein, Erik; Svennson, B.G.; Holt, Arve.
Surface passivation of Silicon Solar Cells by Amorphous Silicon/Silicon Nitride Dual Layers, in: Digest of 15th International Photovoltaic Science and Energy Conference and Solar Energy Exhibition, Shanghai, China, 2005, p.316-317. oral; 2005-11-07 - 2005-11-11
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