|
|
Norsk
versjon
In order to register data in Cristin, you must be an academic or administrative employee.
|
|
|
|
|
|
|
|
|
Showing results 1-50 of 51
|
<< Previous
1
2
Next >>
|
2023
|
1. |
Wright, Daniel Nilsen. 2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac). IEEE (Institute of Electrical and Electronics Engineers) 2023 (ISBN 978-91-89821-06-4) 100 p. SINTEF
Untitled
|
2022
|
2. |
Wright, Daniel Nilsen; Liberale, Alessandro; Vogl, Andreas; Aakvaag, Niels; Savelli, Guillaume; Filhol, Fabien; Hodot, Romain. Optimising thermal management of MEMS element with thermoelectric-cooler. 2022 IMAPS Nordic Conference on Microelectronics Packaging (NordPac); 2022-06-12 - 2022-06-14 SINTEF
Untitled
|
2021
|
3. |
Graff, Joachim Seland; Schuler, Raphael; Song, Xin; Castillo-Hernandez, Gustavo; Skomedal, Gunstein; Enebakk, Erik; Wright, Daniel Nilsen; Stange, Marit Synnøve Sæverud; de Boor, Johannes; Løvvik, Ole Martin; Schrade, Matthias. Fabrication of a Silicide Thermoelectric Module Employing Fractional Factorial Design Principles. Journal of Electronic Materials 2021 ;Volume 50. p. 4041-4049 UiO SINTEF
Untitled
|
|
4. |
Wright, Daniel Nilsen; Liberale, Alessandro; Vogl, Andreas; Aakvaag, Niels; Savelli, Guillaume; Filhol, Fabien; Hodot, Romain. Thermal management of MEMS element with thermoelectric-cooler. I: Proceedings of 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE 2021 ISBN 978-0-9568086-7-7. p. - SINTEF
Untitled
|
2020
|
5. |
Løvvik, Ole Martin; Graff, Joachim Seland; Schrade, Matthias; Sunding, Martin Fleissner; Wright, Daniel Nilsen; Song, Xin; Finstad, Terje; Enebakk, Erik; Tollefsen, Torleif Andre; Skomedal, Gunstein. Silicide module produced in the TESil project. Talk at University of Oslo; 2020-03-09 SINTEF UiO
Untitled
|
|
6. |
Ali, Ayaz; Koybasi, Ozhan; Xing, Wen; Wright, Daniel Nilsen; Varandani, Deepak; Taniguchi, Takashi; Watanabe, Kenji; Mehta, Bodh R.; Belle, Branson. Single digit parts-per-billion NOx detection using MoS2/hBN transistors. Sensors and Actuators A-Physical 2020 ;Volume 315. p. - SINTEF
Untitled
|
|
7. |
Sordo, Guido; Collini, Cristian; Moe, Sigurd T.; Poppe, Erik Utne; Wright, Daniel Nilsen. Wafer bonding process for zero level vacuum packaging of MEMS. I: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC). IEEE (Institute of Electrical and Electronics Engineers) 2020 ISBN 978-1-7281-6293-5. p. - SINTEF
Untitled
|
2019
|
8. |
Ali, Ayaz; Koybasi, Ozhan; Xing, Wen; Benthem Muñiz, Marta; Wright, Daniel Nilsen; Ferber, Alain Marc C; Taniguchi, Takashi; Watanabe, Kenji; Belle, Branson. NOx detection by MoS2/hBN heterostructures. Graphene Week 2019; 2019-09-23 - 2019-09-27 SINTEF
Untitled
|
|
9. |
Ali, Ayaz; Koybasi, Ozhan; Xing, Wen; Muniz, Marta B.; Wright, Daniel Nilsen; Ferber, Alain Marc C; Taniguchi, Takashi; Watanabe, Kenji; Belle, Branson. NOx detection by MoS2/hBN heterostructures. Graphene Week 2019; 2019-09-23 - 2019-09-27 SINTEF
Untitled
|
|
10. |
Koybasi, Ozhan; Ali, Ayaz; Xing, Wen; Wright, Daniel Nilsen; Muniz, Marta B.; Belle, Branson. Gas sensors based on 2D heterostructures. Norwegian NanoSymposium; 2019-10-16 - 2019-10-17 SINTEF
Untitled
|
|
11. |
Sordo, Guido; Wright, Daniel Nilsen; Moe, Sigurd T.; collini, cristian. Through Silicon Vias in MEMS packaging, a review. NordPac 2019; 2019-06-11 - 2019-06-13 SINTEF
Untitled
|
|
12. |
Wright, Daniel Nilsen; Belle, Branson; Graff, Joachim Seland. Development of mechanically compliant flip chip interconnect using single metal coated polymer spheres. European Microelectronics and Packaging Conference (EMPC2019); 2019-09-16 - 2019-09-19 SINTEF
Untitled
|
|
13. |
Wright, Daniel Nilsen; Belle, Branson; Graff, Joachim Seland. Development of mechanically compliant flip chip interconnect using single metal coated polymer spheres. I: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE conference proceedings 2019 ISBN 978-0-9568086-6-0. SINTEF
Untitled
|
2018
|
14. |
Almeida Carvalho, Patricia; Thøgersen, Annett; Ma, Quanbao; Wright, Daniel Nilsen; Diplas, Spyridon; Galeckas, Augustinas; Azarov, Alexander; Jokubavicius, Valdas; Sun, J; Syväjärvi, Mikael; Svensson, Bengt Gunnar; Løvvik, Ole Martin. Boron-doping of cubic SiC for intermediate band solar cells: a scanning transmission electron microscopy study. SciPost Physics 2018 ;Volume 5.(3) p. - SINTEF UiO
Untitled
|
|
15. |
Galeckas, Augustinas; Almeida Carvalho, Patricia; Ma, Quanbao; Azarov, Alexander; Hovden, Sigurd Slettemark; Thøgersen, Annett; Wright, Daniel Nilsen; Diplas, Spyridon; Løvvik, Ole Martin; Jokubavicius, Valdas; Sun, Jianwu; Syväjärvi, Mikael; Svensson, Bengt Gunnar. Optical and microstructural investigation of heavy B-doping effects in sublimation-grown 3C-SiC. Materials Science Forum 2018 ;Volume 924. p. 221-224 SINTEF UiO
Untitled
|
|
16. |
Wright, Daniel Nilsen; Kristiansen, Helge; Gakkestad, Jakob; Hagel, Olle. Reliability of Conductive Adhesives for IoT. NordPac 2019; 2018-06-12 - 2018-06-14 FFI SINTEF
Untitled
|
2017
|
17. |
Gakkestad, Jakob; Sollund, Tomas; Dalsjø, Per G.; Tveit, Bjørn; Taklo, Maaike Margrete Visser; Wright, Daniel Nilsen; Helland, Susanne; Kristiansen, Helge; Johnsen, Christian. A 2.5-D Integrated Data Logger for Measuring Extreme Accelerations. IEEE Transactions on Components, Packaging, and Manufacturing Technology 2017 ;Volume 7.(12) p. 1930-1939 SINTEF FFI
Untitled
|
|
18. |
Ma, Quanbao; Carvalho, Patricia; Galeckas, Augustinas; Azarov, Alexander; Hovden, Sigurd Slettemark; Thøgersen, Annett; Wright, Daniel Nilsen; Diplas, Spyridon; Løvvik, Ole Martin; Jokubavicius, Valdas; Sun, Jianwu; Syväjärvi, Mikael; Svensson, Bengt Gunnar. Characterization of B-implanted 3C-SiC for intermediate band solar cells. Materials Science Forum 2017 ;Volume 897. p. 299-302 UiO SINTEF
Untitled
|
|
19. |
Taklo, Maaike M. Visser; Belle, Branson; Wright, Daniel Nilsen; Vardøy, Astrid-Sofie Borge; Garcia, Alexandre; Eriksson, Torbjörn; Hagel, Olle; Danestig, Magnus. Smart Tags that are exactly Reliable Enough. I: 2017 Pan Pacific Microelectronics Symposium (Pan Pacific), Kauai, HI, USA, 6-9 Feb. 2017. IEEE 2017 ISBN 978-1-5090-4342-2. p. - SINTEF
Untitled
|
|
20. |
Taklo, Maaike M. Visser; Belle, Branson; Wright, Daniel Nilsen; Vardøy, Astrid-Sofie Borge; Garcia, Alexandre; Eriksson, Torbjörn; Hagel, Olle; Danestig, Magnus. Smart Tags that are exactly Reliable Enough. Pan Pacific Microelectronics Symposium (Pan Pacific); 2017-01-06 - 2017-01-09 SINTEF
Untitled
|
|
21. |
Taklo, Maaike M. Visser; Wright, Daniel Nilsen; Kolberg, Sigbjørn; Vardøy, Astrid-Sofie Borge; Hamou, Faycal Riad; Vogl, Andreas; Bakke, Thor; Kristiansen, Helge; Kalland, Erik. Hygrothermal aging of flip-chip assembled MOEMS. 13th International Conference and Exhibition on Device Packaging (DPC); 2017-03-07 - 2017-03-09 SINTEF
Untitled
|
|
22. |
Vardøy, Astrid-Sofie Borge; Garcia, Alexandre; Wright, Daniel Nilsen; Belle, Branson; Taklo, Maaike M. Visser; Hagel, Olle; Xie, Li; Danestig, Magnus; Eriksson, Torbjörn. Soldering of components onto a smart tag - an evaluation of the process window. NordPac conference 2017; 2017-06-19 - 2017-06-20 SINTEF
Untitled
|
|
23. |
Vardøy, Astrid-Sofie Borge; Garcia, Alexandre; Wright, Daniel Nilsen; Belle, Branson; Taklo, Maaike M. Visser; Hagel, Olle; Xie, Li; Danestig, Magnus; Eriksson, Torbjörn. Soldering of components onto a smart tag - an evaluation of the process window. I: IMAPS Nordic Annual Conference 2017. International Microelectronics and Packaging Society (IMAPS) Nordic 2017 ISBN 978-1-5108-4668-5. p. 32-37 SINTEF
Untitled
|
|
24. |
Wright, Daniel Nilsen; Vardøy, Astrid-Sofie Borge; Belle, Branson; Taklo, Maaike M. Visser; Hagel, Olle; Xie, Li; Danestig, Magnus; Eriksson, Torbjörn. Bending Machine for Testing Reliability of Flexible Electronics. NordPac conference 2017; 2017-06-19 - 2017-06-20 SINTEF
Untitled
|
|
25. |
Wright, Daniel Nilsen; Vardøy, Astrid-Sofie Borge; Belle, Branson; Taklo, Maaike Margrete Visser; Hagel, Olle; Xie, Li; Danestig, Magnus; Eriksson, Torbjörn. Bending machine for testing reliability of flexible electronics. I: 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac 2017), NORDPAC 2017, Gothenburg, Sweden, 18-20 June 2017. IEEE (Institute of Electrical and Electronics Engineers) 2017 ISBN 9781538630563. p. - SINTEF
Untitled
|
2016
|
26. |
Gakkestad, Jakob; Opland, Ottar; dalsjø, Per G.; Helland, Susanne; Kristiansen, Helge; Taklo, Maaike Margrete Visser; Wright, Daniel Nilsen. Use of Soldered or Glued PCSB as Interconnection between PCB and Ceramic Package in Harsh Environment. 2016 IMAPS Nordic Conference; 2016-06-05 - 2016-06-07 FFI SINTEF
Untitled
|
|
27. |
Helland, Susanne; Kalland, Erik; Kristiansen, Helge; Gakkestad, Jakob; Opland, Ottar; dalsjø, Per G.; Taklo, Maaike Margrete Visser; Wright, Daniel Nilsen. Use of silver-coated polymer particles in isotropic conductive adhesives for electronics applications. 2016 IMAPS Nordic Conference; 2016-06-05 - 2016-06-07 FFI SINTEF
Untitled
|
|
28. |
Ma, Quanbao; Carvalho, Patricia; Galeckas, Augustinas; Azarov, Alexander; Hovden, Sigurd; Thøgersen, Annett; Wright, Daniel Nilsen; Diplas, Spyridon; Løvvik, Ole Martin; Jokubavicius, Valdas; Sun, Jianwu; Syväjärvi, Mikael; Svensson, Bengt Gunnar. Characterization of B-implanted 3C-SiC for intermediate band solar cells. 11th European Conference on Silicon Carbide and Related Materials (ECSCRM) 2016; 2016-09-25 - 2016-09-29 SINTEF UiO
Untitled
|
|
29. |
Ma, Quanbao; Galeckas, Augustinas; Azarov, Alexander; Thøgersen, Annett; Carvalho, Patricia; Wright, Daniel Nilsen; Diplas, Spyridon; Løvvik, Ole Martin; Jokubavicius, Valdas; Liu, Xinyu; Sun, Jianwu; Syväjärvi, Mikael; Svensson, Bengt Gunnar. Boron-implanted 3C-SiC for intermediate band solar cells. Materials Science Forum 2016 ;Volume 858. p. 291-294 SINTEF UiO
Untitled
|
|
30. |
Syväjärvi, Mikael; Ma, Quanbao; Jokubavicius, Valdas; Galeckas, Augustinas; Sun, Jianwu; Liu, Xinyu; Jansson, Mattias; Wellmann, Peter; Linnarsson, Margareta; Runde, Paal; Johansen, Bertil; Thøgersen, Annett; Diplas, Spyridon; Carvalho, Patricia; Løvvik, Ole Martin; Wright, Daniel Nilsen; Azarov, Alexander; Svensson, Bengt Gunnar. Cubic silicon carbide as a potential photovoltaic material. Solar Energy Materials and Solar Cells 2016 ;Volume 145. p. 104-108 SINTEF UiO
Untitled
|
|
31. |
Taklo, Maaike Margrete Visser; Wright, Daniel Nilsen; Graff, Joachim Seland; Carvalho, Patricia; Austad, Hanne Opsahl; Dalsjø, Per G.; Gakkestad, Jakob; Ishida, Hiroya; Johnsen, Christian. Reliability of Plastic Core Solder Balls in relation to formation of intermetallic compounds. I: 2016 6th Electronic System-Integration Technology Conference (ESTC), Grenoble, 13-15 Sept. 2016. IEEE 2016 ISBN 978-1-5090-1403-3. p. - FFI SINTEF
Untitled
|
|
32. |
Taklo, Maaike Margrete Visser; Wright, Daniel Nilsen; Graff, Joachim Seland; Carvalho, Patricia; Opsahl, Hanne Olstad; dalsjø, Per G.; Gakkestad, Jakob; Ishida, Hiroya; Johnsen, Christian. Reliability of Plastic Core Solder Balls in relation to formation of intermetallic compounds. 6th Electronics System-Integration Technology Conference; 2016-09-13 - 2019-09-16 FFI SINTEF UiO
Untitled
|
|
33. |
Wright, Daniel Nilsen; Belle, Branson; Schjølberg-Henriksen, Kari; Nguyen, Hoang-Vu; Gakkestad, Jakob; Kristiansen, Helge; Taklo, Maaike M. Visser. Anisotropic conductive film for fine-pitch interconnects. Proceedings of the International Symposium on Microelectronics 2016 ;Volume 2016.(1) p. - SINTEF USN FFI
Untitled
|
|
34. |
Wright, Daniel Nilsen; Taklo, Maaike Margrete Visser; Belle, Branson; Kristiansen, Helge; Gakkestad, Jakob; Nguyen, Hoang-Vu; Schjølberg-Henriksen, Kari. Anisotropic conductive film for fine-pitch interconnects. IMAPS 2016; 2016-10-10 - 2016-10-13 FFI USN SINTEF UiO
Untitled
|
|
35. |
Zürcher, Jonas; Del Carro, Luca; Schlottig, Gerd; Wright, Daniel Nilsen; Vardøy, Astrid-Sofie Borge; Taklo, Maaike Margrete Visser; Mills, Tobias; Zschenderlein, Uwe; Wunderle, Bernhard; Brunschwiler, Thomas. All-Copper Flip Chip Interconnects by Pressure-less and Low Temperature Nanoparticle Sintering. The 66th Electronic Components and Technology Conference - ECTC; 2016-05-31 - 2016-06-03 SINTEF
Untitled
|
|
36. |
Zürcher, Jonas; Del Carro, Luca; Schlottig, Gerd; Wright, Daniel Nilsen; Vardøy, Astrid-Sofie Borge; Taklo, Maaike Margrete Visser; Mills, Tobias; Zschenderlein, Uwe; Wunderle, Bernhard; Brunschwiler, Thomas. All-Copper Flip Chip Interconnects by Pressureless and Low Temperature Nanoparticle Sintering. I: 2016 IEEE 66th Proceedings Electronic Components and Technology Conference (ECTC), Las Vegas, May 31 2016-June 3 2016. IEEE 2016 ISBN 978-1-5090-1204-6. p. 343-349 SINTEF
Untitled
|
2015
|
37. |
Brunschwiler, Thomas; Zürcher, Jonas; Schlottig, Gerd; Mills, Tobias; Reip, Paul; Taklo, Maaike Margrete Visser; Vardøy, Astrid-Sofie Borge; Wright, Daniel Nilsen; Baum, Mario; Kumar, Sridhar; Zschenderlein, Uwe; Wunderle, Bernhard. Low Temperature All-Copper Interconnects by Nanoparticle Assembly and Sintering. The Global Interposer Technology 2015 Workshop; 2015-11-04 - 2015-11-07 SINTEF
Untitled
|
|
38. |
Hamou, Faycal Riad; Wright, Daniel Nilsen; Vardøy, Astrid-Sofie Borge; Haupt, Marie; Helland, Susanne; Kristiansen, Helge; Taklo, Maaike Margrete Visser. Analyzing thermo-mechanical reliability of an interconnect based on metal coated polymer spheres (MPS). 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2015); 2015-04-19 - 2015-04-22 SINTEF
Untitled
|
|
39. |
Hamou, Faycal Riad; Wright, Daniel Nilsen; Vardøy, Astrid-Sofie Borge; Haupt, Marie; Helland, Susanne; Kristiansen, Helge; Taklo, Maaike Margrete Visser. Analyzing thermo-mechanical reliability of an interconnect based on metal coated polymer spheres (MPS). I: 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems 2015 (EuroSimE), Budapest. 19-22 April 2015. IEEE conference proceedings 2015 ISBN 978-1-4799-9949-1. p. - SINTEF
Untitled
|
|
40. |
Ma, Quanbao; Galeckas, Augustinas; Azarov, Alexander; Thøgersen, Annett; Carvalho, Patricia; Wright, Daniel Nilsen; Diplas, Spyros; Løvvik, Ole Martin; Jokubavicius, Valdas; Liu, Xinyu; Sun, Jianwu; Syväjärvi, Mikael; Svensson, Bengt Gunnar. Boron‐implanted 3C‐SiC for intermediate band solar cells. 16th International Conference on Silicon Carbide and Related Materials; 2015-10-04 - 2015-10-09 SINTEF UiO
Untitled
|
|
41. |
Taklo, Maaike Margrete Visser; Wright, Daniel Nilsen; Vardøy, Astrid-Sofie Borge; Attard, Alastair; Hajdarevic, Zlatko; Bulacher, Stephan; Saliba, Mario; Wijgaerts, Jan; Borg, Joshua; Vella, David Oscar. Thermomechanical Reliability of Gold Stud Bump Bonding for Large Volume MEMS Devices. I: 2015 IEEE 65th Electronic Components and Technology Conference (ECTC 2015), San Diego, California, USA, 26-29 May 2015. IEEE 2015 ISBN 978-1-4799-8610-1. p. 1357-1364 SINTEF
Untitled
|
|
42. |
Taklo, Maaike Margrete Visser; Wright, Daniel Nilsen; Vardøy, Astrid-Sofie Borge; Attard, Alastair; Hajdarevic, Zlatko; Bulacher, Stephan; Saliba, Mario; Wijgaerts, Jan; Borg, Joshua; Vella, David Oscar. Thermomechanical reliability of gold stud bump bonding for large volume MEMS devices. Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th; 2015-05-26 - 2015-05-29 SINTEF
Untitled
|
|
43. |
Vardøy, Astrid-Sofie Borge; Wright, Daniel Nilsen; Taklo, Maaike Margrete Visser; Zürcher, Jonas; Brunschwiler, Thomas; Kumar, Sridhar; Dixon, Richard N.; Yu, Kerry. All-Copper Interconnects for Homogeneous and Heterogeneous Assemblies. The 20th European Microelectronics and Packaging Conference (EMPC); 2015-09-14 - 2015-09-16 SINTEF
Untitled
|
|
44. |
Wright, Daniel Nilsen; Taklo, Maaike Margrete Visser; Kristiansen, Helge; Baum, Mario; Hoffman, Christian. Novel compliant fine pitch interconnect using Metal Coated Polymer Spheres. IMAPS Nordic 2015; 2015-06-08 - 2015-06-09 SINTEF
Untitled
|
2014
|
45. |
Wright, Daniel Nilsen; Vardøy, Astrid-Sofie Borge; Taklo, Maaike Margrete Visser; Helge, Kristiansen. Metal coated polymer spheres for compliant fine pitch ball grid arrays. 2014 IEEE International conference on 3D integration (3DIC); 2014-12-01 - 2014-12-03 SINTEF
Untitled
|
2013
|
46. |
Taklo, Maaike Margrete Visser; Graff, Joachim Seland; Wright, Daniel Nilsen; Kristiansen, Helge; Hoff, Lars; Waaler, Knut. Failure Analysis Of Thermally And Mechanically Stressed Plastic Core Solder Balls. 2013 Electronic Components & Technology Conference; 2013-05-28 - 2013-05-31 USN SINTEF
Untitled
|
|
47. |
Taklo, Maaike Margrete Visser; Graff, Joachim Seland; Wright, Daniel Nilsen; Kristiansen, Helge; Hoff, Lars; Waaler, Knut. Failure analysis of thermally and mechanically stressed plastic core solder balls. I: Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd, 28-31 May 2013, Las Vegas, NV. IEEE conference proceedings 2013 ISBN 978-1-4799-0233-0. p. 748-754 USN SINTEF
Untitled
|
2008
|
48. |
Nilsen, Daniel. Optical and passivating properties of hydrogenated amorphous silicon nitride deposited by plasma enhanced chemical vapour deposition for applicaton on silicon solar cells. : Det matematisk naturvitenskapelige fakultet, Universitetet i Oslo 2008 154 p. UiO
Untitled
|
2007
|
49. |
Breivik, Tallak Harald; Diplas, Spyridon; Ulyashin, A. G.; Gunnæs, Anette Eleonora; Olaisen, Birger Retterstøl; Holt, Arve; Olsen, Arne; Wright, Daniel Nilsen. Nano-structural properties of ZnO films for Si based heterojunction solar cells. Thin Solid Films 2007 ;Volume 515. p. 8479-8483 UiO IFE
Untitled
|
|
50. |
Diplas, Spyridon; Ulyashin, Alexander; Maknys, Kestutis; Gunnæs, Anette Eleonora; Jørgensen, Sissel; Watts, J.F.; Olsen, Arne; Finstad, Terje; Wright, Daniel Nilsen. On the processing-structure-property relationship of ITO layers deposited on crystalline and amorphous Si. Thin Solid Films 2007 ;Volume 515. p. 8539-8543 UiO IFE
Untitled
|
Show next list
|