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Showing results 1-50 of 208 << Previous 1 2 3 4 5    Next >>

2020
1 Larsson, Andreas; Aasmundtveit, Knut.
On the Microstructure of Off-Eutectic Au-Ge Joints: A High-Temperature Joint. Metallurgical and Materials Transactions A 2020 ;Volume 51.(2) p. 740-749
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2019
2 Aasmundtveit, Knut; Luu, Thi Thuy; Nguyen, Hoang-Vu; Larsson, Andreas; Tollefsen, Torleif Andre.
Solid-liquid InterDiffusion (SLID) Bonding, for Thermally Challenging Applications. I: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC). IEEE conference proceedings 2019 ISBN 978-1-7281-1499-6.
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3 Aasmundtveit, Knut; Roy, Avisek; Ta, Bao Quoc.
Carbon Nanotubes Directly Integrated in CMOS by Local Synthesis - Towards a Wafer-Level Process. I: 2018 IEEE 13th Nanotechnology Materials and Devices Conference (NMDC). IEEE 2019 ISBN 9781538610169. p. -
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4 Aasmundtveit, Knut; Tekseth, Kim Robert Bjørk; Breiby, Dag Werner; Nguyen, Hoang-Vu.
High-energy X-ray Tomography for 3D Void Characterization in Au–Sn Solid-Liquid Interdiffusion (SLID) Bonds. 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC); 2019-09-17 - 2019-09-19
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5 Aasmundtveit, Knut; Tekseth, Kim Robert Bjørk; Breiby, Dag Werner; Nguyen, Hoang-Vu.
High-energy X-ray Tomography for 3D Void Characterization in Au–Sn Solid-Liquid Interdiffusion (SLID) Bonds. I: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE conference proceedings 2019 ISBN 978-0-9568086-6-0. p. -
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6 Do, Nu Bich Duyen; Andreassen, Erik; Edwardsen, Stephen; Lifjeld, Anders; Nguyen, Hoang-Vu; Aasmundtveit, Knut; Imenes, Kristin.
New Encapsulation Concepts for Medical Ultrasound Probes – A Heat Transfer Simulation Study. 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC); 2019-09-17 - 2019-09-19
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7 Do, Nu Bich Duyen; Andreassen, Erik; Edwardsen, Stephen; Lifjeld, Anders; Nguyen, Hoang-Vu; Aasmundtveit, Knut; Imenes, Kristin.
New Encapsulation Concepts for Medical Ultrasound Probes – A Heat Transfer Simulation Study. I: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE conference proceedings 2019 ISBN 978-0-9568086-6-0. p. -
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8 Larsson, Andreas; Tollefsen, Torleif Andre; Aasmundtveit, Knut.
Shear strength of off-eutectic Au-Ge joints at high-temperature. Microelectronics and reliability 2019 ;Volume 99. p. 31-43
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9 Larsson, Andreas; Tollefsen, Torleif Andre; Løvvik, Ole Martin; Aasmundtveit, Knut.
A Review of Eutectic Au-Ge Solder Joints. Metallurgical and Materials Transactions A 2019 ;Volume 50.(10) p. 4632-4641
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10 Nguyen, Hoang-Vu; Kristiansen, Helge; Lifjeld, Anders; Imenes, Kristin; Aasmundtveit, Knut.
Reworkable Anisotropic Conductive Adhesive for Assembly of Medical Devices. 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC); 2019-09-17 - 2019-09-19
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11 Nguyen, Hoang-Vu; Kristiansen, Helge; Lifjeld, Anders; Imenes, Kristin; Aasmundtveit, Knut.
Reworkable Anisotropic Conductive Adhesive for Assembly of Medical Devices. I: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE conference proceedings 2019 ISBN 978-0-9568086-6-0. p. -
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12 Roy, Avisek; Azadmehr, Mehdi; Häfliger, Philipp; Ta, Bao Quoc; Aasmundtveit, Knut Eilif.
Direct Synthesis of Carbon Nanotubes in CMOS-Layout of Micro-heaters. IEEE International Conference on Nanotechnology 2019 ;Volume 2018-July. p. 1-4
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13 Roy, Avisek; Azadmehr, Mehdi; Ta, Bao Quoc; Häfliger, Philipp; Aasmundtveit, Knut.
Design and fabrication of CMOS microstructures to locally synthesize carbon nanotubes for gas sensing. Sensors 2019 ;Volume 19.(19) p. -
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2018
14 Aasmundtveit, Knut Eilif; Eggen, Trym Haakon; Manh, Tung; Nguyen, Hoang-Vu.
In-Bi low-temperature SLID bonding for piezoelectric materials. Soldering & surface mount technology 2018 ;Volume 30.(2) p. 100-105
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15 Aasmundtveit, Knut Eilif; Jiang, Hui; Tollefsen, Torleif Andre; Luu, Thi-Thuy; Nguyen, Hoang-Vu.
Phase determination in SLID bonding. I: 2018 7th Electronic System-Integration Technology Conference (ESTC), Dresden, Germany, 18-21 Sept. 2018. IEEE 2018 ISBN 978-1-5386-6814-6. p. -
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16 Aasmundtveit, Knut Eilif; Luu, Thi Thuy; Nguyen, Hoang-Vu; Larsson, Andreas; Tollefsen, Torleif Andre.
Intermetallic Bonding for High-Temperature Microelectronics and Microsystems: Solid-Liquid Interdiffusion Bonding. I: Intermetallic compounds : formation and applications. IntechOpen 2018 ISBN 978-1-78923-179-3. p. 43-72
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17 Aasmundtveit, Knut Eilif; Roy, Avisek; Ta, Bao Quoc.
Carbon Nanotubes Directly Integrated in CMOS by Local Synthesis – Towards a Wafer-Level Process. IEEE 13th Nanotechnology Materials and Devices Conference (NMDC) - 2018; 2018-10-14 - 2018-10-14
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18 Aasmundtveit, Knut Eilif; Wang, Changhai; Rencz, Márta; Desmulliez, Marc P.Y.; Ender, Ferenc; Imenes, Kristin.
Joint International Master in Smart Systems Integration: University Collaboration for Improved Education. I: EDUCON 2018 - Emerging Trends and Challenges of Engineering Education Education. IEEE 2018 ISBN 978-1-5386-2957-4. p. 624-629
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19 Holhjem, Lars; Strand-Amundsen, Runar James; Aasmundtveit, Knut Eilif; Tønnessen, Tor Inge.
Stability of Laser-Patterned Electrode Compositions. IEEE Transactions on Components, Packaging, and Manufacturing Technology 2018 ;Volume 8.(9) p. 1517-1523
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20 Imenes, Kristin; Aasmundtveit, Knut Eilif.
Educational Needs and Open Education Resources in Micro- and Nanotechnolog. I: EDUCON 2018 - Emerging Trends and Challenges of Engineering Education Education. IEEE 2018 ISBN 978-1-5386-2957-4. p. 1841-1845
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21 Larsson, Andreas; Tollefsen, Torleif Andre; Aasmundtveit, Knut; Løvvik, Ole Martin.
Liquid Solid Diffusion (LSD) Bonding. A novel joining technology. I: 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition. IEEE 2018 ISBN 978-1-5386-2309-1. p. -
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22 Nghiem, Giang Minh; Aasmundtveit, Knut Eilif; Kristiansen, Helge; Bazilchuk, Molly Strimbeck.
Anisotropic Conductive Film (ACF) Bonding: Effect of Interfaces on Contact Resistance. IEEE Electronics System-Integration Technology Conferences (ESTC), 2018; 2018-09-18 - 2018-09-21
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23 Nghiem, Giang Minh; Aasmundtveit, Knut Eilif; Kristiansen, Helge; Bazilchuk, Molly Strimbeck.
Anisotropic Conductive Film (ACF) Bonding: Effect of Interfaces on Contact Resistance. I: 2018 7th Electronic System-Integration Technology Conference (ESTC), Dresden, Germany, 18-21 Sept. 2018. IEEE 2018 ISBN 978-1-5386-6814-6. p. -
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24 Roy, Avisek; Azadmehr, Mehdi; Häfliger, Philipp; Ta, Bao Quoc; Aasmundtveit, Knut Eilif.
Direct Synthesis of Carbon Nanotubes in CMOS-Layout of Micro-heaters. IEEE Nanotechnology conference - IEEE NANO 18; 2018-07-23 - 2018-07-26
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2017
25 Aasmundtveit, Knut Eilif; Eggen, Trym; Manh, Tung; Nguyen, Hoang-Vu.
In–Bi Low-Temperature SLID Bonding for Piezoelectric Materials. The 21st European Microelectronics and Packaging Conference; 2017-09-10 - 2017-09-13
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26 Larsson, Andreas; Tollefsen, Torleif Andre; Løvvik, Ole Martin; Aasmundtveit, Knut Eilif.
Liquid solid diffusion bonding - A novel joining technology. Friday seminar; 2017-10-20 - 2017-10-20
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27 Larsson, Andreas; Tollefsen, Torleif Andre; Løvvik, Ole Martin; Aasmundtveit, Knut Eilif.
Liquid Solid Diffusion (LSD) bonding. The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM); 2017-05-30 - 2017-06-02
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28 Larsson, Andreas; Tollefsen, Torleif Andre; Løvvik, Ole Martin; Aasmundtveit, Knut Eilif.
Liquid Solid Diffusion (LSD) Bonding - A novel joining technology. 21st European microelectronics and packaging conf. (EMPC) & exhibition; 2017-09-10 - 2017-09-13
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29 Larsson, Andreas; Tollefsen, Torleif Andre; Løvvik, Ole Martin; Aasmundtveit, Knut Eilif.
Thermoelectric module for high temperature application. I: 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2017): Orlando, Florida, USA 30 May - 2 June 2017. IEEE 2017 ISBN 978-1-5090-2995-2. p. -
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30 Larsson, Andreas; Tollefsen, Torleif Andre; Løvvik, Ole Martin; Aasmundtveit, Knut Eilif.
Thermoelectric module for high temperature application. The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM); 2017-05-30
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31 Nguyen, Hoang-Vu; Do, Nu Bich Duyen; Aasmundtveit, Knut Eilif.
Low-Temperature High-Throughput Assembly Technology for Transducer Array in Medical Imaging Applications. Electronic Components and Technology Conference; 2017-05-30 - 2017-06-02
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32 Nguyen, Hoang-Vu; Do, Nu Bich Duyen; Aasmundtveit, Knut Eilif.
Low-Temperature High-Throughput Assembly Technology for Transducer Array in Medical Imaging Applications. I: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC). IEEE conference proceedings 2017 ISBN 978-1-5090-6315-4. p. 2121-2128
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33 Roy, Avisek; Ender, Ferenc; Azadmehr, Mehdi; Aasmundtveit, Knut Eilif.
CMOS micro-heater design for direct integration of carbon nanotubes. Microelectronics and reliability 2017 ;Volume 79. p. 517-525
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34 Roy, Avisek; Ender, Ferenc; Azadmehr, Mehdi; Ta, Bao Quoc; Aasmundtveit, Knut Eilif.
Design considerations of CMOS micro-heaters to directly synthesize carbon nanotubes for gas sensing applications. IEEE International Conference on Nanotechnology 2017 p. 828-833
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35 Roy, Avisek; Ender, Ferenc; Azadmehr, Mehdi; Ta, Bao Quoc; Aasmundtveit, Knut Eilif.
Design considerations of CMOS micro-heaters to directly synthesize carbon nanotubes for gas sensing applications. IEEE Nano 17 conference; 2017-07-25 - 2017-07-28
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36 Sandvand, Åsmund; Halvorsen, Einar; Aasmundtveit, Knut Eilif; Jakobsen, Henrik.
Identification and Elimination of Hygro-Thermo-Mechanical Stress-Effects in a High-Precision MEMS Pressure Sensor. Journal of microelectromechanical systems 2017 ;Volume 26.(2) p. 415-423
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2016
37 Nghiem, Giang Minh; Nguyen, Huyen Thanh; Aasmundtveit, Knut Eilif; Kristiansen, Helge.
Simulation of Adhesive Flow during ACF Bonding Process for Display Interconnect. I: 2016 6th Electronic System-Integration Technology Conference (ESTC), Grenoble, 13-15 Sept. 2016. IEEE 2016 ISBN 978-1-5090-1403-3. p. -
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38 Aasmundtveit, Knut Eilif; Luu, Thi Thuy; Tollefsen, Torleif Andre; Wang, Kaiying; Nguyen, Hoang-Vu; Hoivik, Nils.
Solid-Liquid Interdiffusion (SLID) Bonding - Intermetallic Bonding for High Temperature Applications. I: 2016 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP). IEEE 2016 ISBN 978-1-5090-1457-6. p. -
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39 Aasmundtveit, Knut Eilif; Nguyen, Vy; Nguyen, Hoang-Vu.
In-Bi low-temperature SLID bonding. I: 2016 6th Electronic System-Integration Technology Conference (ESTC), Grenoble, 13-15 Sept. 2016. IEEE 2016 ISBN 978-1-5090-1403-3. p. -
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40 Do, Nu Bich Duyen; Nguyen, Hoang-Vu; Aasmundtveit, Knut Eilif.
Assembly of Transducer Array on Flexible Substrate Using A Novel Isotropic Conductive Adhesive for Medical Imaging Applications. The IMAPS Nordic Annual Conference; 2016-06-05 - 2016-06-07
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41 Gustavsen, Kim Robert; Nygård, Ken Alexander; Honerød-Bentsen, Preben; Du, Kang; Liu, Guohua; Tayyib, Muhammad; Breiby, Dag Werner; Weibye, Kristian; Nilsen, Ola; Aasmundtveit, Knut Eilif; Wang, Kaiying.
Wafer-level fabrication and characterization of amorphous thin films MoS2 prepared by RF magnetron sputtering technique. ECS Transactions 2016 ;Volume 75.(13) p. 131-137
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42 Larsson, Andreas; Tollefsen, Torleif Andre; Aasmundtveit, Knut Eilif.
Ni-Sn solid liquid interdiffusion (SLID) bonding — Process, bond characteristics and strength. I: 2016 6th Electronic System-Integration Technology Conference (ESTC), Grenoble, 13-15 Sept. 2016. IEEE 2016 ISBN 978-1-5090-1403-3. p. -
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43 Larsson, Andreas; Tollefsen, Torleif Andre; Aasmundtveit, Knut Eilif.
Ni–Sn solid liquid interdiffusion (SLID) bonding – Process, bond characteristics and strength. 6th Electronics System-Integration Technology Conference; 2016-09-13 - 2016-09-16
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44 Larsson, Andreas; Tollefsen, Torleif Andre; Løvvik, Ole Martin; Aasmundtveit, Knut Eilif.
Electronic packaging for harsh environments. HSN Expo; 2016-06-01 - 2016-06-02
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45 Larsson, Andreas; Tollefsen, Torleif Andre; Løvvik, Ole Martin; Aasmundtveit, Knut Eilif.
Liquid Solid Diffusion (LSD) Bonding – Joint structure and bonding method. Materials science and technology; 2016-10-23 - 2016-10-27
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46 Larsson, Andreas; Tollefsen, Torleif Andre; Løvvik, Ole Martin; Aasmundtveit, Knut Eilif.
Ni–Sn Solid Liquid Interdiffusion (SLID) bonding. NanoNetwork - Workshop; 2016-06-13 - 2016-06-15
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47 Manh, Tung; Nguyen, Hoang-Vu; Le, Ahn Duy; Aasmundtveit, Knut Eilif; Hoff, Lars; Eggen, Trym; Johansen, Tonni Franke; Lanteri, Frederic; Gelly, Jean-François.
Au-Sn Solid-Liquid Interdiffusion (SLID) bonding for piezoelectric ultrasonic transducers. Proceedings - IEEE Ultrasonics Symposium 2016
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48 Manh, Tung; Nguyen, Hoang-Vu; Le, Duy; Aasmundtveit, Knut Eilif; Hoff, Lars; Eggen, Trym; Johansen, Tonni Franke; Gelly, Jean-François; Lanteri, Frederic.
Au-Sn Solid-Liquid Interdiffusion (SLID) bonding for piezoelectric ultrasonic transducers. 2016 IEEE International Ultrasonics Symposium Proceedings; 2016-09-18 - 2016-09-21
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49 Nghiem, Giang Minh; Kristiansen, Helge; Aasmundtveit, Knut.
Investigation of contacts between metal and transparent conductive oxides. I: 2016 6th Electronic System-Integration Technology Conference (ESTC), Grenoble, 13-15 Sept. 2016. IEEE 2016 ISBN 978-1-5090-1403-3. p. -
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50 Nguyen, Hoang-Vu; He, Jianying; Helland, Tore; Kristiansen, Helge; Aasmundtveit, Knut Eilif.
Electrical characterization of individual metal-coated polymer spheres used in isotropic conductive adhesives. Journal of Applied Polymer Science 2016 ;Volume 133:43764.(31) p. -
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