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Viser treff 1-9 av 9

2020
1 Larsson, Andreas; Aasmundtveit, Knut.
On the Microstructure of Off-Eutectic Au-Ge Joints: A High-Temperature Joint. Metallurgical and Materials Transactions A 2020 ;Volum 51.(2) s. 740-749
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2019
2 Aasmundtveit, Knut; Luu, Thi Thuy; Nguyen, Hoang-Vu; Larsson, Andreas; Tollefsen, Torleif Andre.
Solid-liquid InterDiffusion (SLID) Bonding, for Thermally Challenging Applications. I: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC). IEEE conference proceedings 2019 ISBN 978-1-7281-1499-6.
USN Untitled
 
3 Aasmundtveit, Knut; Roy, Avisek; Ta, Bao Quoc.
Carbon nanotubes directly integrated in CMOS by local synthesis-Towards a wafer-level process. I: 2018 IEEE 13th Nanotechnology Materials and Devices Conference (NMDC). IEEE (Institute of Electrical and Electronics Engineers) 2019 ISBN 9781538610169. s. -
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4 Aasmundtveit, Knut; Tekseth, Kim Robert Bjørk; Breiby, Dag Werner; Nguyen, Hoang-Vu.
High-energy x-ray tomography for 3d void characterization in au-sn solid-liquid interdiffusion (SLID) bonds. I: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE conference proceedings 2019 ISBN 978-0-9568086-6-0. s. -
USN NTNU Untitled
 
5 Do, Nu Bich Duyen; Andreassen, Erik; Edwardsen, Stephen; Lifjeld, Anders; Nguyen, Hoang-Vu; Aasmundtveit, Knut; Imenes, Kristin.
New encapsulation concepts for medical ultrasound probes- A heat transfer simulation study. I: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE conference proceedings 2019 ISBN 978-0-9568086-6-0. s. -
USN SINTEF Untitled
 
6 Larsson, Andreas; Tollefsen, Torleif Andre; Aasmundtveit, Knut.
Shear strength of off-eutectic Au-Ge joints at high-temperature. Microelectronics and reliability 2019 ;Volum 99. s. 31-43
USN Untitled
 
7 Larsson, Andreas; Tollefsen, Torleif Andre; Løvvik, Ole Martin; Aasmundtveit, Knut.
A Review of Eutectic Au-Ge Solder Joints. Metallurgical and Materials Transactions A 2019 ;Volum 50.(10) s. 4632-4641
USN SINTEF Untitled
 
8 Nguyen, Hoang-Vu; Kristiansen, Helge; Lifjeld, Anders; Imenes, Kristin; Aasmundtveit, Knut.
Reworkable Anisotropic Conductive Adhesive for Assembly of Medical Devices. I: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE conference proceedings 2019 ISBN 978-0-9568086-6-0. s. -
USN Untitled
 
9 Roy, Avisek; Azadmehr, Mehdi; Ta, Bao Quoc; Häfliger, Philipp; Aasmundtveit, Knut.
Design and fabrication of CMOS microstructures to locally synthesize carbon nanotubes for gas sensing. Sensors 2019 ;Volum 19.(19) s. -
USN UiO Untitled