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2019
1 Do, Nu Bich Duyen; Andreassen, Erik; Edwardsen, Stephen; Lifjeld, Anders; Nguyen, Hoang-Vu; Aasmundtveit, Knut; Imenes, Kristin.
New encapsulation concepts for medical ultrasound probes- A heat transfer simulation study. I: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE conference proceedings 2019 ISBN 978-0-9568086-6-0. s. -
USN SINTEF Untitled
 
2 Nguyen, Hoang-Vu; Kristiansen, Helge; Lifjeld, Anders; Imenes, Kristin; Aasmundtveit, Knut.
Reworkable Anisotropic Conductive Adhesive for Assembly of Medical Devices. I: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE conference proceedings 2019 ISBN 978-0-9568086-6-0. s. -
USN Untitled